Rectangular Heat Pipes with Surface Contact for Thin Electronics Cooling

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Solution Overview

Problem

Thin electronic apparatuses, such as laptops, face challenges in improving cooling performance due to increased heat generation from higher processing capacities, while maintaining a thin form factor.

Innovation Solution

The electronic apparatus incorporates a plurality of heat pipes with rectangular cross-sections, where the side surfaces orthogonal to the heat receiving surfaces are in surface contact, reducing heat resistance and enhancing cooling performance. The heat pipes are manufactured through a process involving primary formed bodies with rectangular cross-sections, which are then assembled to ensure proper surface contact and thermal connection to the heating element.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a single heat pipe is used for cooling, then the apparatus can maintain a thin form factor, but cooling performance is insufficient for high processing capacities

Engineering Contradiction:

Improvecooling performanceVSAvoidnumber of heat pipes

Core Design Contradiction:

TemperatureVSQuantity of substance

Solution Approach 1:

The cooling system is divided into multiple heat pipes instead of using a single heat pipe. Each heat pipe has a rectangular cross-section and is arranged to be in surface contact with adjacent heat pipes, creating a segmented cooling structure that improves heat dissipation capacity while maintaining a thin profile.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple heat pipes are combined in a configuration where their side surfaces are in direct surface contact with each other. This merging of multiple heat transfer paths enhances overall cooling performance while the integrated arrangement maintains a compact, thin form factor suitable for portable devices.

Inventive Principle:

Principle #5Merging (Combining)

2Temperature

If multiple heat pipes are used to improve cooling performance, then cooling capacity increases, but heat resistance between heat pipes increases

Engineering Contradiction:

Improvecooling capacityVSAvoidheat resistance

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

The heat pipes are given a rectangular cross-section with flat side surfaces instead of circular cross-sections. This geometric modification enables the side surfaces of adjacent heat pipes to be in direct surface contact, significantly reducing thermal contact resistance between heat pipes while maintaining effective heat transfer pathways.

Inventive Principle:

Principle #14Spheroidality (Curvature)

3Loss of energy

If round or elliptical heat pipe materials are pressed to form flat surfaces for surface contact, then heat resistance decreases, but the materials cannot be formed wide and thin

Engineering Contradiction:

Improveheat resistanceVSAvoidform factor

Core Design Contradiction:

Loss of energyVSShape

Solution Approach 1:

The heat pipe materials are formed into rectangular cross-sections with flat side surfaces during the manufacturing process itself, rather than attempting to press flat surfaces onto round or elliptical materials afterward. This preliminary formation of the correct geometry enables direct surface contact between adjacent heat pipes and achieves the desired wide and thin form factor.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively lowers heat resistance, improves cooling performance, and allows for the thinning of the electronic apparatus, making it suitable for mobile workstations and other thin form factor devices.

Implementation Method 1

a plurality of heat pipes that is thermally connected to the heating element, in which each of the heat pipes has a cross section having a rectangular shape

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

side surfaces of the heat pipes, which are adjacent to each other, are in surface contact with each other... heat resistance is lowered and cooling performance is improved

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12250792B2Heat pipes of an electronic apparatus and method of manufacturing the same

Publication Date: 2025.03.11 LENOVO (SINGAPORE) PTE LTD

AI summary

An electronic apparatus includes: a heating element; and a plurality of heat pipes that is thermally connected to the heating element. Each of the heat pipes has a cross section having a rectangular shape, a heat receiving surface thermally connected to the heating element, and a side surface orthogonal to the heat receiving surface. The side surfaces of the heat pipes, which are adjacent to each other, are in surface contact with each other.