Rectangular Probe Offset Segments for Precision Positioning
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Solution Overview
Problem
Conventional rectangular probes in probe card devices are limited by their structural design, which hinders the provision of new technical effects in semiconductor wafer testing processes.
Innovation Solution
The probe card device incorporates a unique rectangular probe design with an upper positioned segment, an upper contacting segment, a deformable segment, a lower positioned segment, and a lower contacting segment, featuring an offset portion with staggered first and second positioned portions, allowing for effective positioning and contact in a probe card device with MEMS technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional rectangular probe structures are used, then manufacturing simplicity is maintained, but positioning precision and technical innovation are limited
Solution Approach 1:
The probe structure is divided into multiple segments: upper positioned segment, upper contacting segment, deformable segment, lower positioned segment, and lower contacting segment. Each segment performs a specific function, allowing the probe to achieve precise positioning while maintaining manufacturing feasibility through modular design.
Solution Approach 2:
The probe employs asymmetric positioning through the offset portion and staggered arrangement of first and second positioned portions. The first positioned portion and second positioned portion are offset from each other in the width direction, creating an asymmetric structure that enhances positioning precision without significantly complicating the manufacturing process.
2Ease of operation
If conventional rectangular probe structures are used, then ease of manufacture is maintained, but positioning functionality is insufficient
Solution Approach 1:
The upper positioned segment with offset portion and staggered positioned portions is designed to preliminarily position the probe before the contacting segments make electrical contact. This preliminary positioning action ensures accurate alignment with the semiconductor wafer pads, improving positioning functionality while the entire structure remains manufacturable using standard MEMS processes.
3Adaptability or versatility
If new probe structures are developed, then technical innovation is achieved, but structural complexity increases
Solution Approach 1:
The probe incorporates a deformable segment that allows dynamic adjustment during the testing process. The deformable segment can flex to accommodate variations in wafer thickness or positioning tolerances, providing adaptability and technical innovation. Despite this dynamic feature, the structure remains relatively simple as it uses a single deformable section rather than multiple complex mechanisms.
Data Source
AI summary
A rectangular probe of a probe card device includes an upper positioned segment, an upper contacting segment, a deformable segment, a lower positioned segment, and a lower contacting segment. The upper positioned segment includes an offset portion, a first positioned portion extending from the offset portion along a first direction, and a second positioned portion extending from a second direction being parallel to and opposite to the first direction. In a width direction perpendicular to the first direction, a width of the first positioned portion is 25%-95% of a width of the offset portion, and a width of the second positioned portion is 25%-95% of the width of the offset portion. The upper contacting segment extends from the first positioned portion along the first direction. The deformable segment, the lower positioned segment, and the lower contacting segment sequentially extend from the second positioned portion along the second direction.