Rectangular Wire Adhesion Layer for High-Frequency Loss and Welding
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Solution Overview
Problem
Conventional high-frequency rectangular wires face issues with rigid welding due to enamel coating soot and inadequate adhesiveness between conductor strands during bending, affecting weldability and bending workability.
Innovation Solution
Incorporating an interlayer insulating layer of thermoplastic resin between conductor strands and an adhesion layer of thermoplastic resin on the outer periphery, which enhances adhesiveness and suppresses high-frequency loss, allowing for easier and more rigid welding while improving bending workability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If enamel coating is formed on rectangular metallic bodies to achieve high-frequency property, then high-frequency property is improved, but weldability deteriorates due to soot generation during welding
Solution Approach 1:
The patent changes the material parameter of the coating from enamel (thermosetting resin) to thermoplastic resin, which has different thermal and mechanical properties. This parameter change allows the coating to suppress high-frequency loss while enabling rigid welding without soot generation, as thermoplastic resin behaves differently under welding heat compared to enamel coating.
Solution Approach 2:
The patent uses composite material structure with thermoplastic resin as the coating material that combines the benefits of both insulation (suppressing high-frequency loss) and weldability (no soot generation). The thermoplastic resin coating creates a composite structure that integrates electrical insulation and welding compatibility in a single material system.
2Ease of manufacture
If no enamel coating is used to improve weldability, then weldability is improved, but adhesiveness between conductor strands deteriorates during bending work
Solution Approach 1:
The patent changes the coating material parameter from no coating or enamel coating to thermoplastic resin coating. This parameter change provides adequate adhesiveness during bending work while maintaining good weldability, as thermoplastic resin has appropriate melting and adhesion characteristics that balance these two requirements.
3Loss of energy
If conventional enamel coating is used, then high-frequency property is developed, but bending workability deteriorates due to inadequate adhesiveness
Solution Approach 1:
The patent changes the coating material from enamel to thermoplastic resin, which has different thermal-mechanical parameters. This change improves bending workability by providing adequate adhesiveness between conductor strands during bending, while still suppressing high-frequency loss through the insulating properties of the thermoplastic resin coating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables excellent high-frequency properties, improved weldability, and enhanced bending workability by eliminating soot generation during welding and increasing the adhesiveness between the conductor and insulating layers, resulting in reliable wire jointing and reduced high-frequency loss.
Implementation Method 1
an insulating outer layer which is formed on the outer periphery of the stacked conductor strands through an adhesion layer of a thermoplastic resin
Implementation Method 2
an interlayer insulating layer between stacked conductor strands... allows suppression of high-frequency loss
Data Source
Figure 1~2
Figure 3(a)~3(d)
Figure 4(a)~4(d)
AI summary
An assembled wire, comprising: an assembled conductor composed of a plurality of conductor strands each having a rectangular cross-section, stacked and arranged each other across an interlayer insulating layer; and an insulating outer layer that coats the assembled conductor including the interlayer insulating layer; and further comprising: an adhesion layer composed of a thermoplastic resin having a thickness of 3 µm or more and 10 µm or less between the assembled conductor and the insulating outer layer.