Rectifier Manufacturing via Cast Skin Press-Fit Hole
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Solution Overview
Problem
Conventional rectifier manufacturing methods require excessive cutting processes, leading to high costs and environmental concerns, and apply excessive loads to semiconductor pellets, compromising their reliability and heat dissipation efficiency.
Innovation Solution
A method involving a cast skin surface press-fit hole in the heat dissipation heat sink, a press-fit head, an insertion guide, and a load receiving jig with a protrusion portion to align and securely press-fit the rectifying element, reducing cutting processes and load on the semiconductor pellet, while maintaining positional accuracy and heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cutting processes are used to form press-fit holes, then manufacturing precision can be achieved, but manufacturing costs increase and environmental impact worsens
Solution Approach 1:
The invention extracts and eliminates the cutting process from the manufacturing flow by using a punching die to directly form press-fit holes in the heat dissipation fins. This removes the harmful cutting operation while maintaining the necessary hole formation precision, thereby reducing manufacturing costs and environmental impact.
Solution Approach 2:
The invention changes the manufacturing parameter from cutting to punching. By using a punching die with appropriate dimensions and applying controlled pressing force, the press-fit holes are formed through material displacement rather than removal, achieving the same functional result with lower cost and environmental burden.
2Reliability
If excessive load is applied during press-fitting to secure retention, then reliability of retention is improved, but semiconductor pellet deformation occurs
Solution Approach 1:
The invention applies local quality by designing the pressing force to be distributed specifically on the outer peripheral surface of the columnar heat sink, away from the semiconductor pellet location. This localized pressing approach secures retention reliability while preventing deformation of the semiconductor pellet, as the load is concentrated on the robust outer periphery rather than the sensitive pellet area.
Solution Approach 2:
The invention introduces the outer peripheral surface of the columnar heat sink as an intermediary that absorbs and distributes the pressing load. This intermediary structure protects the semiconductor pellet from direct excessive load while still enabling secure press-fitting through the heat sink's outer periphery, which has higher mechanical strength.
3Reliability
If press-fit allowance is increased to prevent rectifying element drop, then retention reliability is improved, but load on semiconductor pellet increases
Solution Approach 1:
The invention applies local quality by concentrating the press-fit allowance and resulting load on the outer peripheral surface of the columnar heat sink, which is structurally designed to withstand higher stresses. This localized load application prevents rectifying element drop while protecting the semiconductor pellet from excessive force, as the outer periphery serves as a load-bearing zone distinct from the pellet location.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing costs and environmental impact by minimizing cutting processes, ensuring reliable retention of the rectifying element with stable heat dissipation and positional accuracy, and preventing excessive load on semiconductor pellets.
Implementation Method 1
press-fitting the rectifying element into the press-fit hole by pressing the periphery of the press-fit hole
Implementation Method 2
heat dissipation heat sink
Data Source
AI summary
A heat dissipation heat sink having a press-fit hole whose inner peripheral surface is a cast skin surface is included; the heat dissipation heat sink is sandwiched by the press-fit head and the insertion guide by aligning the axis of a rectifying element in an insertion guide with the axis of the press-fit hole and making the press-fit head face the heat dissipation heat sink; a protrusion portion of a load receiving jig is made to face the rectifying element in the insertion guide; and the rectifying element is press-fitted into the press-fit hole of the heat dissipation heat sink by pressing the periphery of the press-fit hole of the heat dissipation heat sink (22,23) by the press-fit head and receiving a load applied to the rectifying element by the protrusion portion of the load receiving jig.