Rectifier Assembly Cooling Structure for High Heat Flux Control
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Solution Overview
Problem
Conventional cooling systems for power electronics in rectifier assemblies are inefficient in managing high heat flux while meeting size and weight requirements, particularly in applications like aircraft, where power electronics are mounted close to generators with different temperature limits.
Innovation Solution
A rectifier assembly with thermal management structures featuring louvers and channels for fluid flow, allowing heat transfer between bus bars and diodes, and a hybrid thermal management approach using both louvers and larger thermal masses to maintain effective cooling during fluid flow and no-flow conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional cooling systems are used for power electronics in rectifier assemblies, then the system structure is simple, but the system cannot effectively manage high heat flux while meeting size and weight requirements
Solution Approach 1:
The cooling system is segmented into multiple thermal management structures, each with specific functions (e.g., first thermal management structure for heat dissipation, second for thermal mass). This segmentation allows optimized heat flux management while controlling overall system weight by distributing cooling functions across multiple lighter components rather than one heavy monolithic cooler.
Solution Approach 2:
Different regions of the cooling system have different thermal properties - the first thermal management structure has high thermal conductivity for efficient heat transfer from diodes, while the second structure provides thermal mass for temperature stabilization. This local differentiation of thermal characteristics enables effective heat flux management with optimized weight distribution.
2Temperature
If larger thermal management structures are used to manage high heat flux, then cooling effectiveness improves, but the system size and weight increase
Solution Approach 1:
The thermal management system is divided into two distinct structures with different volumes and functions. The first structure is compact and optimized for direct heat removal from diodes, while the second structure provides supplemental thermal mass. This segmentation achieves effective temperature control without requiring one large monolithic thermal management system.
Solution Approach 2:
The system merges two thermal management structures with complementary functions - active heat dissipation and passive thermal mass - into a unified cooling solution. This combination achieves superior temperature control effectiveness while maintaining compact overall volume compared to a single large thermal management system.
3Volume of moving object
If the rectifier assembly is mounted close to the generator, then space utilization improves, but the power electronics are exposed to higher temperatures from the generator
Solution Approach 1:
The first thermal management structure acts as an intermediary between the generator and the power electronics diodes. It provides a thermal interface that actively manages heat transfer, protecting the temperature-sensitive diodes from the high-temperature generator environment while enabling close mounting for space efficiency.
Solution Approach 2:
The thermal management structures provide localized thermal protection to the power electronics region while allowing the generator to operate at its higher temperature. Different zones of the assembly have different thermal characteristics - the generator region operates hot for efficiency, while the diode region is actively cooled to appropriate temperatures.
4Temperature
If efficient cooling means are used to maintain low temperatures for power electronics, then temperature control improves, but the system complexity increases
Solution Approach 1:
The system merges active cooling (first thermal management structure with fluid flow) and passive thermal management (second structure with thermal mass) into a unified solution. This combination achieves effective junction temperature control while avoiding the complexity of purely active cooling systems with pumps and controls.
Solution Approach 2:
The thermal management structures serve multiple functions simultaneously - they provide electrical connection between bus bars and diodes, act as heat sinks for temperature control, and serve as mounting structures. This multi-functionality reduces overall system complexity by eliminating separate components for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively manages high heat flux in power electronics by maintaining optimal temperatures and meeting size and weight requirements, ensuring reliable operation even under varying fluid flow conditions.
Implementation Method 1
The first thermal management structure is configured to be in thermal communication between the first bus bar and a first side of the first diode to transfer heat between the first bus bar and the first diode
Implementation Method 2
The first thermal management structure is also configured to allow a fluid to flow therethrough to transfer heat from the first thermal management structure to the fluid flowing therethrough
Data Source
AI summary
In accordance with at least one aspect of this disclosure, a rectifier assembly includes, at least, a first diode disposed between a first bus bar and a second bus bar. The rectifier assembly further includes, a first thermal management structure and a second thermal management structure. The first thermal management structure is configured to electrically connect the first bus bar to the first diode and be in thermal communication between the first bus bar and a first side of the first diode to transfer heat between the first bus bar and the first diode. The first thermal management structure is configured to transfer heat between the first bus bar and the first thermal management structure. The first thermal management structure is also configured to allow a fluid to flow therethrough to transfer heat from the first thermal management structure to the fluid flowing therethrough.