Rectifier Assembly Cooling Structure for Diode Junction Heat
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Solution Overview
Problem
Conventional cooling systems for power electronics in rectifier diode assemblies are inadequate in managing high heat flux while meeting size and weight requirements, particularly in applications like aircraft where power electronics have lower junction temperature ratings than generator windings.
Innovation Solution
A rectifier assembly with a thermal management structure that includes louvers extending from bus bars to diodes, allowing for fluid flow to transfer heat, and a hybrid approach combining metallic louvers for electrical connection and thermal management, along with channels in bus bars for fluid supply, to efficiently manage heat between diodes and bus bars.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling systems are used for power electronics, then the system structure is simple, but the heat flux management is inadequate and temperature requirements cannot be met
Solution Approach 1:
The patent combines electrical connection and thermal management functions into a single hybrid structure. The metallic louver assembly serves both as an electrical conductor connecting the diode to the bus bar and as a thermal management structure with integrated fluid channels, eliminating the need for separate cooling components and reducing overall system complexity while effectively managing heat flux.
Solution Approach 2:
The hybrid thermal management structure performs multiple functions simultaneously: it provides electrical connection between diode and bus bar, conducts heat away from the diode, and serves as a fluid flow channel for cooling. This multi-functionality allows the system to meet temperature requirements without adding separate dedicated cooling components.
2Temperature
If efficient cooling means are added to maintain sufficient temperatures for power electronics, then temperature control improves, but size and weight requirements cannot be met
Solution Approach 1:
By merging the electrical connection function with the thermal management function into a single hybrid structure, the patent eliminates redundant components. The metallic louver assembly simultaneously provides electrical conductivity and thermal management with integrated fluid channels, reducing the overall weight compared to separate electrical and cooling systems.
Solution Approach 2:
The hybrid structure serves multiple functions including electrical connection, heat conduction, and fluid flow channeling. This multi-functionality allows efficient cooling of power electronics without adding dedicated cooling components that would increase the weight of the rectifier assembly.
3Temperature
If efficient cooling means are added to maintain sufficient temperatures for power electronics, then temperature control improves, but size requirements cannot be met
Solution Approach 1:
The patent merges electrical connection and thermal management into a single hybrid structure, eliminating the need for separate cooling components. This integration reduces the overall volume of the rectifier assembly while maintaining effective temperature control through the integrated fluid channels within the metallic louver assembly.
Solution Approach 2:
The hybrid thermal management structure performs multiple functions including electrical connection, heat conduction, and fluid flow channeling within a compact design. This multi-functionality enables efficient cooling of power electronics without increasing the size of the rectifier assembly.
4Temperature
If Joule heating is reduced through improved thermal management, then temperature requirements are met, but system complexity increases
Solution Approach 1:
The patent combines electrical connection and thermal management functions into a single hybrid structure. The metallic louver assembly serves both as an electrical conductor and as a thermal management structure with integrated fluid channels, reducing overall system complexity while effectively managing heat flux and Joule heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains sufficient temperatures for power electronics by utilizing a hybrid thermal management approach that combines direct cooling at the diode level with a larger thermal mass, reducing Joule heating and ensuring temperature requirements are met even during loss of cooling fluid flow.
Implementation Method 1
The first thermal management structure is configured to be in thermal communication between the first bus bar and a first side of the first diode to transfer heat between the first bus bar and the first diode
Implementation Method 2
The first thermal management structure is also configured to allow a fluid to flow therethrough to transfer heat from the first thermal management structure to the fluid flowing therethrough
Implementation Method 3
reducing Joule heating and ensuring temperature requirements are met even during loss of cooling fluid flow
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
In accordance with at least one aspect of this disclosure, a rectifier assembly includes, at least, a first diode (218) disposed between a first bus bar (214a) and a second bus bar (214b). The rectifier assembly further includes, a first thermal management structure (208) and a second thermal management structure (210). The first thermal management structure (208) is configured to electrically connect the first bus bar (214a) to the first diode (218) and be in thermal communication with the first bus bar (214a) and a first side (220) of the first diode to transfer heat between the first bus bar (214a) and the first diode (218). The first thermal management structure (208) is also configured to allow a fluid to flow therethrough to transfer heat from the first thermal management structure (208) to the fluid flowing therethrough.