Conductive Rectifier Housing with Diode Recesses

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Solution Overview

Problem

Existing power conversion circuit designs for applications like welding and plasma cutting face challenges in robust packaging that can withstand environmental and vibration stresses, particularly in mobile equipment, leading to increased costs and assembly time.

Innovation Solution

A novel rectifier module design featuring a conductive housing with recesses for high side and low side diodes, allowing efficient transmission of AC input power and providing a robust, compact, and efficiently assembled solution for power conversion circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If surface mounted or lead frame packages are used for rectifier components, then ease of manufacture is improved, but reliability under vibration and environmental stress deteriorates

Engineering Contradiction:

Improveease of manufactureVSAvoidreliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent combines multiple rectifier diodes into a single integrated module housed in a common encapsulation. This merging approach maintains ease of manufacture through standardized packaging while improving reliability by providing unified mechanical support and environmental protection for all diode components, reducing vulnerability to vibration and environmental stress.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The rectifier module design creates a universal package that can be adapted for various power conversion applications. The standardized housing and mounting configuration provide robust environmental protection while maintaining ease of assembly across different equipment types, resolving the contradiction between manufacturing simplicity and reliability under stress.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If robust packaging is used to withstand environmental and vibration stresses, then reliability is improved, but device complexity and assembly time increase

Engineering Contradiction:

ImprovereliabilityVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates multiple diode components into a single pre-assembled rectifier module with unified housing and mounting structure. This merging eliminates the need for complex individual packaging of each diode while maintaining robust protection against environmental and vibration stresses, thereby reducing overall device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The rectifier module is pre-assembled and pre-protected within its housing before installation into the final equipment. This preliminary action of creating a robust, self-contained module simplifies the overall assembly process and reduces on-site complexity while ensuring reliability from the outset.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If robust packaging is used to withstand environmental and vibration stresses, then reliability is improved, but manufacturing cost increases

Engineering Contradiction:

ImprovereliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple diode components into a single integrated rectifier module with common housing. This merging approach achieves robust environmental and vibration protection while reducing total manufacturing cost by eliminating redundant packaging materials and simplifying the assembly process across multiple components.

Inventive Principle:

Principle #5Merging (Combining)

4Ease of manufacture

If conventional rectifier packaging is used, then ease of manufacture is improved, but space efficiency deteriorates

Engineering Contradiction:

Improveease of manufactureVSAvoidvolume

Core Design Contradiction:

Ease of manufactureVSVolume of moving object

Solution Approach 1:

The patent nests multiple diode components within a compact common housing structure, arranging them in a space-efficient configuration. This nesting approach maintains ease of manufacture through standardized packaging while significantly reducing the overall volume occupied by the rectifier assembly compared to conventional separate packaging.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables robust, space-efficient, and cost-effective power conversion in mobile applications by ensuring reliable assembly and operation under varying conditions, with improved manufacturing efficiency and performance.

Implementation Method 1

The conductive housing is configured to be placed at an alternating input potential in operation and to transmit input power to the diodes via interior surfaces of the recesses

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS9888592B2Rectifier module for power conversion circuits

Publication Date: 2018.02.06 ILLINOIS TOOL WORKS INC

AI summary

A rectifier module comprises a conductive housing made of injection molded aluminum or aluminum alloy. Diodes are inserted into recesses formed in the housing. The housing is placed at an alternating input potential during operation, and transmits alternating current input power to the diode modules for conversion to direct current power. Multiple recesses may be provided for high and low side diodes, of which there may be one or many. Multiple such modules may be provided for converting multiple phases of input power to direct current power.