Recyclable Blister Pack Using Dry Tack Cohesive Adhesive
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Solution Overview
Problem
Current consumer packaging technologies, such as card/blister and clamshell packages, face challenges in recyclability, environmental impact, and cost due to high hydrocarbon usage and complex opening mechanisms, which do not meet sustainability scorecard targets.
Innovation Solution
A recyclable blister pack system utilizing a die-cut substrate with a dry tack cohesive adhesive and a thermoformed RPET blister layer, allowing for full color graphics, tamper resistance, and efficient separation for recycling, comprising a substrate with regions, a dry tack cohesive layer, and a blister layer that forms a seal only with itself and the substrate, facilitating recyclability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat-sealing is used to seal the blister to the card, then the package is secure and tamper-resistant, but the adhesive and fibers bond to the blister and prevent efficient recycling
Solution Approach 1:
The adhesive is extracted from the blister surface and placed only on the card backing, eliminating the bonding agent that prevents recycling. The blister can then be removed cleanly from the card without adhesive residue, enabling efficient recycling of the blister material while maintaining package security through the die-cut substrate design.
Solution Approach 2:
The die-cut substrate acts as an intermediary between the card and blister, providing structural integrity and tamper resistance without requiring adhesive bonding to the blister itself. This intermediary structure allows the blister to be securely held in place during use while enabling clean separation for recycling.
2Reliability
If clamshells are heat or RF sealed for tamper resistance, then the package is secure, but the extreme difficulty in opening the pack causes customer dissatisfaction
Solution Approach 1:
The package is segmented into distinct components (substrate, blister, adhesive layers) with different functions. The die-cut substrate provides tamper resistance through its structural design, while the blister remains easily removable for product access. This segmentation allows tamper resistance and ease of opening to be achieved through different mechanisms rather than forcing a single sealing method to provide both functions.
3Ease of manufacture
If card/blister packages are used, then the package size and weight are limited by heat-sealing machine constraints, but this restricts packaging flexibility
Solution Approach 1:
The heat-sealing mechanical system is replaced with a die-cut substrate system that uses mechanical interlocking and adhesive bonding to the card backing rather than heat-sealing the blister itself. This substitution removes the size and weight constraints imposed by heat-sealing machine capabilities, allowing greater flexibility in package dimensions and blister designs while maintaining manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides improved recyclability, reduced environmental impact, and cost-effectiveness by using recycled materials and minimizing hydrocarbon usage, while maintaining tamper resistance and allowing for easy product viewing.
Implementation Method 1
a dry tack cohesive adhesive layer applied to the first and second regions... The adhesive properties of the cohesive layer are selected such that it is capable of forming a seal only with itself and the substrate
Data Source
AI summary
A recyclable blister pack system is provided, including a substrate having a dry tack cohesive adhesive layer deposited on one of its surfaces and a blister layer for receiving a product. The properties of the dry tack cohesive are selected so the blister layer is separable from the substrate without leaving substantial substrate residue on the blister layer. This improves the recyclability of the blister layer.