Recyclable Carrier Substrate for Hermetic Packaging
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Solution Overview
Problem
Fragile semiconductor substrates, such as those used in MEMS and acoustic wave devices, are difficult to handle during processing due to their susceptibility to damage, and existing technologies lack effective solutions for minimizing wafer bow, stress, and cracks during manufacturing.
Innovation Solution
A recyclable carrier substrate with a coefficient of thermal expansion matching that of the device substrate, coated with temporary adhesive and dielectric materials, and featuring seal rings for hermetic sealing, allows for secure bonding and subsequent removal without damaging the substrate, enabling reuse and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fragile semiconductor substrate is handled during processing, then the device can be manufactured, but the substrate is susceptible to damage including wafer bow, stress, and cracks
Solution Approach 1:
The patent applies beforehand cushioning by providing a carrier substrate before processing the fragile semiconductor substrate. The carrier substrate serves as a supportive foundation that prevents wafer bow, stress, and cracks during handling and processing. The carrier substrate is configured with appropriate mechanical properties to cushion and protect the fragile device substrate throughout the manufacturing process.
Solution Approach 2:
The patent uses an intermediary approach by introducing a carrier substrate as a mediator between the handling equipment and the fragile semiconductor substrate. This carrier substrate acts as an intermediate support structure that enables safe handling, processing, and manipulation of the fragile device without direct contact that could cause damage. The carrier substrate can be temporarily attached and removed without affecting the final device integrity.
2Ease of operation
If a carrier substrate is used to support the fragile substrate during processing, then handling is improved, but the carrier substrate cannot be reused increasing manufacturing costs
Solution Approach 1:
The patent implements discarding and recovering by designing the carrier substrate to be reusable after the fragile semiconductor substrate is processed and removed. The carrier substrate can be cleaned, inspected, and prepared for subsequent use with other device substrates. This recovery and reuse capability eliminates the need to discard the carrier substrate after a single use, thereby reducing material waste and manufacturing costs while maintaining ease of operation throughout the process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes wafer bow, stress, and cracks, allows for the reuse of the carrier substrate, and results in a low-cost, functional, and hermetically sealed packaged electronic device with a reduced thickness, suitable for applications like RF devices and duplexers.
Implementation Method 1
depositing a layer of temporary adhesive material on at least a portion of a surface of a carrier substrate
Implementation Method 2
depositing a layer of dielectric material on at least a portion of the layer of temporary adhesive material
Data Source
AI summary
According to various aspects and embodiments, a method for forming a packaged electronic device is provided. In accordance with one embodiment, the method comprises depositing a layer of temporary adhesive material on at least a portion of a surface of a first substrate having a coefficient of thermal expansion, depositing a layer of dielectric material on at least a portion of the layer of temporary adhesive material, forming at least one seal ring on at least a portion of the layer of dielectric material, providing a second substrate having a coefficient of thermal expansion that is substantially the same as the coefficient of thermal expansion of the first substrate, the second substrate having at least one bonding structure attached to a surface of the second substrate, and aligning the at least one seal ring to the at least one bonding structure and bonding the first substrate to the second substrate.