Recyclable Copper Clad Laminate Using Degradable Epoxy Resin
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Solution Overview
Problem
The recycling of waste printed circuit boards, particularly those using thermosetting epoxy resin, is challenging due to the irreversible cross-linking reaction, making it difficult to decompose or remelt, leading to environmental pollution and inefficient metal and fiber recovery.
Innovation Solution
Development of a recyclable copper-clad laminate (CCL) using a degradable epoxy resin composition with a degradable curing agent, which can be partially cured and embedded with glass fibers, allowing for degradation under mild conditions, enabling the separation and recovery of epoxy resin, copper foil, and reinforcing materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermosetting epoxy resin is used to prepare CCL, then mechanical strength, adhesion, and thermal stability are improved, but recyclability deteriorates due to irreversible cross-linking
Solution Approach 1:
The patent changes the chemical parameters of the curing agent from conventional non-degradable types to degradable types (such as degradable polyamines with specific molecular structures containing hydrolyzable bonds). This parameter change allows the cured epoxy resin to maintain cross-linked network strength while introducing chemical susceptibility to degradation under controlled conditions, thereby resolving the contradiction between mechanical strength and recyclability
Solution Approach 2:
The patent creates a composite material system combining degradable curing agents with epoxy resin and fiber reinforcements. The degradable curing agent forms a cross-linked network that provides mechanical strength, while the embedded fiber structure and copper foil layers create a composite that can be selectively separated through degradation of the resin matrix, thus achieving both strength and recyclability
2Loss of substance
If conventional recycling methods (wet processing, fire treatment, physical mechanical processing) are used, then metal recovery is achieved, but environmental pollution increases and fiber-resin recovery is limited
Solution Approach 1:
The patent converts the previously harmful irreversible cross-linking of epoxy resin into a beneficial feature by using degradable curing agents that create cross-links susceptible to controlled degradation. The cross-linked structure that once prevented recycling now enables selective degradation under mild conditions, allowing complete recovery of all components including fibers and resin without environmental pollution
Solution Approach 2:
The patent replaces harsh mechanical and chemical recycling systems (crushing, sorting, acid pickling, fire treatment) with a chemical degradation system using mild aqueous solutions at low temperatures. The degradable curing agent enables the resin matrix to decompose chemically under gentle conditions, substituting violent mechanical separation and polluting chemical processes with a controlled chemical degradation approach that recovers all materials
3Ease of manufacture
If degradable curing agent is used to enable recycling, then recyclability is improved, but manufacturing complexity increases due to formulation requirements
Solution Approach 1:
The patent manages formulation complexity by systematically selecting degradable curing agents with specific molecular structure parameters (such as polyamines with controllable degradation rates). By establishing clear parameter ranges for the curing agents and standardizing the epoxy resin-to-curing agent ratios, the patent simplifies the formulation process despite using degradable components, making the manufacturing process manageable while achieving recyclability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The recyclable CCL allows for efficient recycling of printed circuit boards with over 96% mass recovery ratio of epoxy resin and reinforcing materials, maintaining their mechanical properties and texture, thus addressing the environmental and economic limitations of existing recycling methods.
Implementation Method 1
the degradable epoxy resin composition can include an epoxy resin and a degradable curing agent... which can be partially cured and embedded with glass fibers, allowing for degradation under mild conditions
Data Source
AI summary
The present invention provides recyclable copper clad laminates (CCLs) each including copper foil and a recyclable/degradable fiber composition, and printed circuit boards that are made of or include the CCLs of this invention. Also provided are method for recycling these CCLs and printed circuit boards.


