Rapid Exchange Device Compliant Kinematic Mount for Reticle Stage
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Solution Overview
Problem
Conventional reticle exchange devices are not designed for vacuum environments and are inefficient, leading to particle generation and contamination, which increases manufacturing defects and costs in semiconductor lithography processes, especially in Extreme Ultraviolet (EUV) lithography.
Innovation Solution
A Rapid Exchange Device (RED) with a gripper and kinematic mount using compliant pins is introduced, allowing the patterning device to move in only three degrees of freedom and the reticle stage to move in a second set of three degrees of freedom, minimizing contact and particle generation while maintaining compliance for efficient reticle exchange in a vacuum environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional reticle exchange devices are used, then the exchange process can be performed, but particle generation occurs and contamination increases
Solution Approach 1:
The reticle stage is designed with dynamic compliance in three degrees of freedom (horizontal movements), allowing it to adapt to reticle positioning variations during exchange. This dynamic adjustment minimizes relative movement between the reticle and stage, thereby reducing particle generation while maintaining reliable reticle positioning for manufacturing
Solution Approach 2:
The system changes the compliance parameters of the reticle stage by enabling movement in specific degrees of freedom during the reticle exchange process. The stage is compliant in horizontal directions (three degrees of freedom) to accommodate reticle positioning, while maintaining stability in vertical directions. This parameter adjustment reduces particle generation without compromising manufacturing reliability
2Productivity
If reticle exchange is performed quickly, then productivity increases, but compliance and precision may be compromised
Solution Approach 1:
The reticle stage incorporates dynamic compliance mechanisms that allow quick adjustment during reticle exchange while maintaining precision. The stage can rapidly move in three horizontal degrees of freedom to accommodate reticle positioning, enabling fast exchange without sacrificing manufacturing precision. This dynamic capability resolves the contradiction between speed and accuracy
Solution Approach 2:
The compliance control is segmented into different degrees of freedom: the reticle stage is compliant in three horizontal degrees of freedom for rapid positioning during exchange, while maintaining stability in vertical degrees of freedom for precision. This segmentation allows the system to achieve both fast exchange speed and manufacturing precision simultaneously
3Ease of operation
If the reticle stage is compliant in all six degrees of freedom, then ease of operation increases, but device complexity increases
Solution Approach 1:
The reticle stage is designed with local compliance in specific degrees of freedom rather than uniform compliance throughout. It is compliant in three horizontal degrees of freedom to facilitate easy reticle exchange operations, while maintaining rigidity in vertical degrees of freedom. This localized compliance approach improves ease of operation without unnecessarily increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The RED significantly reduces reticle exchange time, minimizes particle contamination, and enhances the efficiency of semiconductor device manufacturing by allowing simultaneous loading and unloading of multiple reticles, thereby increasing throughput and reducing manufacturing defects.
Implementation Method 1
controlling the patterning device to be compliant in only a first three degrees of freedom
Implementation Method 2
controlling the reticle stage to be compliant in only a second three degrees of freedom
Data Source
AI summary
Provided is a method to load a patterning device (1010) onto a reticle stage (RS) of a lithography system, a Rapid Exchange Device (RED) configured to load a patterning device (1010) onto a reticle stage (RS) of a lithography system, and a system for manufacturing a semiconductor device lithographically. The method involves sharing compliance among six degree of freedom between the reticle stage (RS) and the RED. The RED complies in only a first three degrees of freedom and the reticle stage (RS) in only a second three degrees of freedom until the reticle stage (RS) and patterning device (1010) are substantially in contact and coplanar.


