Red Line Phosphor Coating and Dicing for LED Stability
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Solution Overview
Problem
Mn4+ activated complex fluoride materials used in lighting systems are susceptible to degradation under high temperature and humidity conditions, limiting their efficacy and reliability.
Innovation Solution
A method involving the combination of a phosphor of formula I, such as K2[SiF6]:Mn4+, with a polymer binder, coating this composite material on a semiconductor wafer, and using a specific cutting fluid in the dicing process to form LED chips, which reduces degradation and maintains the material's luminescent properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If Mn4+ activated complex fluoride materials are used for high efficacy lighting, then luminous efficacy and CRI are improved, but the materials become susceptible to degradation under high temperature and humidity conditions
Solution Approach 1:
A polymer binder is introduced as an intermediary material that coats the phosphor particles, forming a protective barrier against moisture and thermal degradation while allowing the phosphor to maintain its luminescent properties. The binder serves as a mediator between the phosphor and the harsh operating environment.
Solution Approach 2:
The invention creates a composite material system consisting of phosphor particles embedded in a polymer binder matrix. This composite structure combines the luminescent properties of the phosphor with the protective and flexible characteristics of the polymer, achieving both high efficacy and reliability.
2Productivity
If standard dicing processes are used for LED chip fabrication, then manufacturing efficiency is maintained, but the phosphor materials undergo degradation during cutting
Solution Approach 1:
The polymer binder acts as a protective intermediary during the dicing process, shielding the phosphor particles from mechanical stress and chemical degradation caused by cutting fluids and mechanical contact, thereby maintaining phosphor integrity during high-speed manufacturing.
Solution Approach 2:
The polymer coating is applied beforehand to cushion and protect the phosphor particles from the harsh conditions of the dicing process, including mechanical impact and exposure to cutting fluids, before the actual cutting occurs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces the degradation of the phosphor materials, enhancing their stability and maintaining high quantum efficiency and luminous efficacy even under challenging conditions.
Implementation Method 1
These materials absorb blue light strongly and efficiently emit between about 610-635 nanometers (nm) with little deep red/NIR emission. Quantum efficiency can exceed to 85% under blue (440-460 nm) excitation.
Implementation Method 2
A cutting fluid of the cutting fluid apparatus includes a C1-C20 alcohol, a C1-C20 ketone, a C1-C20 acetate compound, acetic acid, oleic acid, carboxylic acid, a source of A, silicic acid, or a combination thereof
Data Source
AI summary
Methods for fabricating coated semiconductor elements are presented. The methods include the steps of combining a phosphor of formula I and a polymer binder to form a composite material, providing a semiconductor wafer including IniGajAlkN, wherein 0≤i; 0≤j; 0≤k, and a sum of i, j and k is equal to 1, coating the composite material on a surface of the semiconductor wafer to form a coated semiconductor wafer, and dicing the coated semiconductor wafer using a cutting fluid apparatus to form one or more coated semiconductor elements. A cutting fluid of the cutting fluid apparatus includes a C1-C20 alcohol, a C1-C20 ketone, a C1-C20 acetate compound, acetic acid, oleic acid, carboxylic acid, a source of A, silicic acid, or a combination thereof.