Redistributed Wafer Using Temporary Substrate Transfer
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Solution Overview
Problem
Conventional semiconductor device packages have large dimensions due to input/output elements like leads, pins, and solder balls, which hinder miniaturization efforts, and existing methods for forming redistribution layers directly on wafers are prone to errors and thermal stresses.
Innovation Solution
A method involving the formation of redistribution layers on a temporary substrate, allowing for separate testing and transfer to a wafer, enabling the creation of redistributed electronic devices without damaging the wafer if errors occur, and allowing for multiple redistribution layers to be added sequentially.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If redistribution layers are formed directly on the wafer, then the process is simpler and faster, but errors and thermal stresses may damage the wafer
Solution Approach 1:
The process is divided into separate stages: forming redistribution layers on a temporary substrate first, testing them independently, and then transferring to the wafer. This segmentation allows error detection and correction before wafer processing, preventing waste of expensive wafers while maintaining overall process efficiency.
Solution Approach 2:
Redistribution layers are formed and tested on a temporary substrate before being transferred to the wafer. This preliminary action allows for process validation and error detection early in the manufacturing sequence, protecting the wafer from potential damage while enabling process optimization.
2Adaptability or versatility
If multiple redistribution layers with different materials and processing temperatures are used, then device functionality is improved, but process complexity increases
Solution Approach 1:
Multiple redistribution layers are formed on the temporary substrate in sequential stages, allowing each layer to be processed with its specific materials and temperature requirements without interfering with other layers. This segmentation simplifies the overall process by isolating complex material requirements to individual processing steps on the temporary substrate before final wafer transfer.
3Length of moving object
If wafer-scale packaging is used to decrease device dimensions, then miniaturization is achieved, but handling difficulties increase
Solution Approach 1:
A temporary substrate serves as an intermediary platform for forming and testing redistribution layers before transferring them to the wafer. This intermediary approach enables precise handling and processing of small-scale devices while maintaining wafer-scale manufacturing benefits, as the temporary substrate provides a stable platform for delicate operations.
Data Source
AI summary
A method of making redistributed electronic devices that includes providing a wafer having a plurality of electronic devices, each electronic device having a pattern of contact areas forming die pads. The method also includes forming redistribution layers on a temporary substrate having a pattern of contact areas forming wafer bonding pads matching the die pads and a pattern of contact areas forming redistributed pads different than the wafer bonding pads, the wafer bonding pads are coupled to the redistributed pads through a plurality of stacked conductive and insulating layers. The die pads are coupled to the wafer bonding pads, and the temporary substrate is removed. The wafer and redistribution layers are then divided into a plurality of redistributed electronic devices.