Redistribution Structure Packaging for Dense 3DIC Thermal Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face limitations in integration density and efficiency due to constraints in feature size reduction and packaging, which affect performance and heat dissipation, particularly in three-dimensional integrated circuits (3DICs).
Innovation Solution
A semiconductor package manufacturing method involving multiple redistribution structures, encapsulants, and conductive connectors is developed, allowing for efficient integration and heat dissipation by forming a stacked structure with redistribution layers and encapsulants that physically and electrically connect dies, enabling effective heat dissipation and enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If feature size is reduced to increase integration density, then more components can be integrated into a given area, but manufacturing precision and reliability deteriorate
Solution Approach 1:
The patent transitions from two-dimensional planar integration to three-dimensional stacked integration using multiple redistribution structures at different vertical levels. This allows increasing integration density by utilizing the vertical dimension rather than continuously reducing feature sizes in the horizontal plane, thereby avoiding the manufacturing precision limitations associated with miniaturization.
Solution Approach 2:
The patent implements nested redistribution structures where a second redistribution structure is formed over a first redistribution structure, with dies embedded between them. This nested configuration enables multiple functional layers to be integrated vertically, increasing overall integration density without requiring proportional reduction in individual feature dimensions.
2Quantity of substance
If three-dimensional integrated circuits are implemented to increase integration density, then more components can be integrated, but heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces encapsulants as intermediary materials between dies and redistribution structures. These encapsulants provide thermal management functionality by facilitating heat transfer from the dies through the stacked structure, addressing the heat dissipation challenge inherent in three-dimensional integration while maintaining high integration density.
Solution Approach 2:
The patent segments the integrated circuit into multiple discrete dies stacked vertically with redistribution structures between them. This segmentation creates separate thermal zones and enables independent thermal management for each die, improving overall heat dissipation efficiency compared to a monolithic three-dimensional structure.
3Quantity of substance
If multiple redistribution structures are stacked to increase integration density, then electrical connectivity is enhanced, but device complexity increases
Solution Approach 1:
The redistribution structures in the patent serve multiple functions simultaneously: they provide electrical connectivity between stacked dies, provide mechanical support for the embedded dies, facilitate heat dissipation through thermal pathways, and enable precise positioning of components. This multi-functionality reduces the need for separate dedicated structures for each function, thereby managing complexity despite the stacked configuration.
Data Source
AI summary
A semiconductor package includes a first redistribution structure, a second redistribution structure, a first die, a first encapsulant, a second die, a second encapsulant, conductive connectors, and a third die. The second redistribution structure is over the first redistribution structure. The first die is located between the first redistribution structure and the second redistribution structure. The first encapsulant laterally encapsulates the first die. The second die is disposed on and electrically connected to the second redistribution structure. The second encapsulant laterally encapsulates the second die. The conductive connectors surround the second die and are embedded in the second encapsulant. The third die is disposed over the second die. The third die is in physical contact with the second encapsulant and the conductive connectors.