Redistribution Board High Low Voltage Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor chip packaging technologies face challenges in effectively isolating high voltage and low voltage signals, leading to potential electrical failures due to creepage issues over time, especially when exposed to environmental conditions.
Innovation Solution
A redistribution board design with separate conductive layers for low and high voltage signals, separated by a non-conductive layer, and a conductive connector surrounded by a low voltage trace, increasing the creepage distance and providing electrical shielding to reduce the risk of electrical failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If high voltage and low voltage signals are placed on the same conductive layer, then the board design is simpler, but electrical failures occur due to creepage issues over time
Solution Approach 1:
The conductive layer is segmented into separate first and second conductive layers, with the first layer carrying low voltage signals and the second layer carrying high voltage signals. This segmentation physically separates voltage levels to prevent creepage failures while maintaining organized signal routing.
Solution Approach 2:
The patent transitions from a planar single-layer design to a multi-layer vertical architecture. By stacking conductive layers in the vertical dimension and separating them with non-conductive layers, the design achieves both compactness and enhanced electrical isolation against creepage.
2Reliability
If separate conductive layers are used for high and low voltage signals, then electrical isolation is improved, but the board structure becomes more complex
Solution Approach 1:
Multiple functional elements are merged into integrated structures: conductive connectors combine through-hole and pad functions, while non-conductive layers simultaneously provide electrical isolation and mechanical support. This merging reduces the number of discrete components needed.
Solution Approach 2:
The non-conductive layers serve multiple functions: electrical insulation between voltage layers, mechanical support for conductive structures, and structural framework for the entire board. The conductive connectors also provide both electrical connection and structural anchoring.
3Reliability
If creepage distance is increased by expanding lateral board size, then electrical failure risk is reduced, but the board occupies more space
Solution Approach 1:
The patent moves the creepage distance measurement from the lateral plane to the vertical dimension by stacking conductive layers. The non-conductive layers provide the required creepage distance in the vertical direction, allowing compact lateral dimensions while maintaining adequate electrical isolation.
Solution Approach 2:
The design changes the spatial configuration parameter from lateral separation to vertical separation. By altering the arrangement from horizontal to vertical layering, the system achieves the required creepage distance without increasing lateral footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively isolates high and low voltage signals, reducing the risk of electrical failures and creepage issues, while maintaining a compact design without increasing the board's lateral size, thus enhancing the reliability and longevity of semiconductor chip packaging.
Implementation Method 1
a non-conductive layer, the second conductive layer being spaced apart from the first conductive layer by the non-conductive layer
Implementation Method 2
a conductive connector extending from a mounting surface of the redistribution board to the second conductive layer, the connector being surrounded by a low voltage trace of the first conductive layer
Data Source
AI summary
A redistribution board includes a first conductive layer including a redistribution structure for low voltage signals, a second conductive layer including a redistribution structure for high voltage signals, and a non-conductive layer. The second conductive layer is spaced apart from the first conductive layer by the non-conductive layer. The redistribution board further includes a conductive connector extending from a mounting surface of the redistribution board to the second conductive layer. The conductive connector is surrounded by a low voltage trace of the first conductive layer.