Redistribution Circuit Structure Segmented Electroplating
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Solution Overview
Problem
Conventional methods for forming redistribution circuit structures in semiconductor packaging, such as fan-out panel-level packaging, face challenges in achieving uniformity and efficiency in electroplating processes, leading to potential thickness variations and inefficiencies in connecting chips to circuit boards.
Innovation Solution
A method involving a substrate with a peelable layer, a patterned metal layer, and segmented electroplating, where a conductive seed layer is divided into sections and electroplated in multiple stages to ensure uniformity and reuse of the substrate, improving the uniformity and efficiency of the redistribution circuit structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional electroplating is performed on the entire substrate at once, then the process is simple and fast, but the plating layer thickness is non-uniform
Solution Approach 1:
The substrate surface is divided into multiple independent sections with individual isolation layers and openings. Each section has its own electroplating chamber that can be independently controlled, allowing separate electroplating processes for each section. This segmentation enables uniform plating thickness control in each section while maintaining overall process manageability.
2Loss of substance
If the substrate is reused after peeling, then material waste is reduced and cost decreases, but contamination and defects may occur
Solution Approach 1:
The substrate is designed with a peeling structure that allows the plating layer to be cleanly separated from the substrate surface. After electroplating and peeling, the substrate can be reused for subsequent electroplating cycles. The isolation layers between sections prevent cross-contamination during reuse, maintaining substrate quality and enabling multiple recycling cycles.
3Productivity
If multiple sections are electroplated simultaneously, then productivity increases, but thickness uniformity across sections becomes difficult to control
Solution Approach 1:
The electroplating system is divided into multiple independent electroplating chambers, each corresponding to a specific section on the substrate. Each chamber can be operated independently with its own plating parameters, allowing simultaneous electroplating of multiple sections while maintaining precise thickness control in each section through independent parameter adjustment.
Solution Approach 2:
Each electroplating chamber is configured with local optimization capabilities, allowing different plating parameters (current density, plating time, electrolyte composition) to be applied to different sections based on their specific requirements. This enables each section to achieve optimal thickness uniformity while the overall system maintains high productivity through parallel operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the uniformity of the plating layer thickness and improves the efficiency of chip-to-circuit board connections by allowing for controlled electroplating in segments, reducing waste and enabling the reuse of substrates.
Implementation Method 1
at least one section is selected to be electroplated to form a plating layer on the seed layer each time, and electroplating is performed at least twice until all sections have been electroplated
Data Source
AI summary
A method for making a redistribution circuit structure provides a substrate and forms a peelable layer on the substrate. A metal layer is formed on a surface of the peelable layer, the metal layer including a controlling circuit including at least two spaced units. A first photoresist layer is formed on a portion of the surface of the peelable layer and an insulating layer is applied to completely cover the first photoresist layer and the controlling circuit. Through holes are defined in the insulating layer to partially expose the controlling circuit and a seed layer applied on the insulating layer. A block layer is laid to divide the seed layer into multiple sections and electroplating in each section on a portion of the seed layer is applied to form a plating layer with better uniformity of thickness across all sections.