Redistribution Structure Compensation Circuit Electroplating
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Solution Overview
Problem
The issue of uneven coating thickness in the conductive layer of redistribution layers (RDL) occurs when the size of the wafer or substrate increases, leading to thickness variations between the central and edge regions during electroplating.
Innovation Solution
A compensation circuit layer is formed around the redistribution layer, which is electrically insulated from it, and connected to subsequent layers to reduce voltage differences and ensure uniform thickness by providing a path for electroplating that mitigates the thickness disparity between central and edge regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the size of the wafer or substrate is increased to accommodate larger circuit areas, then the area of the redistribution layer is improved, but the uniformity of the conductive layer thickness deteriorates due to voltage differences between central and edge regions during electroplating
Solution Approach 1:
The patent divides the compensation circuit into multiple segments (first compensation circuit, second compensation circuit, third compensation circuit) that are distributed across different regions of the substrate. Each segment independently compensates for voltage differences in its local area, enabling effective thickness uniformity control across large substrate areas without requiring a single large compensation circuit that would be impractical to implement.
2Area of stationary object
If the size of the wafer or substrate is increased, then the area of the redistribution layer is improved, but the voltage difference between central and edge regions increases during electroplating
Solution Approach 1:
The compensation circuit acts as an intermediary element between the power source and the redistribution layer. It provides an additional current path that compensates for the voltage drop occurring in the traditional direct plating approach. By introducing this intermediate compensation mechanism, the system can maintain more uniform voltage distribution across large substrate areas, thereby improving reliability of the electroplating process.
3Manufacturing precision
If a compensation circuit layer is added to reduce voltage differences, then the uniformity of conductive layer thickness is improved, but the device complexity increases
Solution Approach 1:
The compensation circuit layer serves multiple functions simultaneously: it compensates for voltage differences during electroplating, provides current distribution pathways, and can be integrated with existing circuit layouts. By designing the compensation circuit to perform multiple roles, the patent reduces the need for separate dedicated components, thereby mitigating the increase in device complexity while achieving improved thickness uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compensation circuit layer effectively reduces the voltage difference and thickness variation between the central and edge regions, resulting in more uniform conductive layer thickness across large areas during electroplating.
Implementation Method 1
The conductive layer of the RDL is usually formed by electroplating
Data Source
AI summary
Provided is a forming method of a redistribution structure including: forming a first redistribution layer and a first compensation circuit layer on a substrate, wherein the first compensation circuit layer surrounds the first redistribution layer, and the first compensation circuit layer and the first redistribution layer are electrically insulated from each other; forming a first dielectric layer on the first redistribution layer and the first compensation circuit layer; and forming a second redistribution layer and a second compensation circuit layer on the first dielectric layer, wherein the second compensation circuit layer surrounds the second redistribution layer, the second compensation circuit layer and the second redistribution layer are electrically insulated from each other, the second compensation circuit layer is connected to the first compensation circuit layer, and the second redistribution layer is connected to the first redistribution layer.