Redistribution Heat Dissipation in Semiconductor Packages for PoP Reliability

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Solution Overview

Problem

The semiconductor industry faces challenges in reducing heat accumulation during packaging processes, which can lead to delamination and oxidation issues in Package-on-Package (PoP) technology, affecting the reliability and quality of semiconductor packages.

Innovation Solution

The implementation of a semiconductor package with a front-side and back-side redistribution structure, including through vias and a backside enhancement layer, along with dummy pads that dissipate heat through metallization patterns, reducing heat accumulation and preventing delamination and oxidation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If conventional PoP packaging is used to achieve high integration density, then component density is improved, but heat accumulation occurs causing delamination and oxidation

Engineering Contradiction:

Improvecomponent densityVSAvoidheat accumulation

Core Design Contradiction:

Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The patent introduces dummy pads that are specifically designed to absorb and dissipate heat generated during laser drilling processes. These dummy pads convert the harmful heat accumulation into a manageable thermal distribution pattern, preventing delamination and oxidation while maintaining the high integration density benefits of PoP packaging.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent applies local quality by strategically placing dummy pads in specific regions where heat accumulation is most problematic. The metallization patterns are localized to areas requiring heat dissipation, allowing the packaging structure to maintain high integration density in functional areas while providing targeted thermal management where needed.

Inventive Principle:

Principle #3Local quality

2Reliability

If laser drilling is used to create through vias for redistribution structures, then connectivity is improved, but heat accumulation causes delamination of the backside enhancement layer

Engineering Contradiction:

ImproveconnectivityVSAvoiddelamination resistance

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent implements beforehand cushioning by placing dummy pads with heat-dissipating metallization patterns in advance of the laser drilling process. These pre-positioned structures serve as thermal buffers that absorb and distribute heat before it can cause delamination of the backside enhancement layer, thereby protecting the structural integrity while enabling through via connectivity.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The dummy pads act as intermediary structures between the laser drilling process and the backside enhancement layer. They mediate the thermal interaction by absorbing and dissipating heat, preventing direct thermal damage to the enhancement layer while still allowing the laser drilling to create the necessary through vias for connectivity.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Object-affected harmful factors

If dummy pads are added to dissipate heat, then heat accumulation is reduced, but device complexity increases

Engineering Contradiction:

Improveheat accumulationVSAvoidpackage structure

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The dummy pads serve multiple functions: they dissipate heat during laser drilling, provide mechanical support structures, and can be integrated into the existing redistribution layer architecture. This multi-functionality reduces the need for separate dedicated heat dissipation components, thereby limiting the increase in device complexity while effectively addressing heat accumulation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the heat dissipation function with the existing dummy pad structures that are already part of the redistribution layer design. By combining thermal management with existing structural elements rather than adding completely separate components, the increase in device complexity is minimized while still achieving effective heat reduction.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the long-term reliability of semiconductor packages by minimizing heat-induced delamination and improving the quality of conductive connectors through reduced oxidation, thereby ensuring better packaging performance.

Implementation Method 1

dummy pads that dissipate heat through metallization patterns

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230420331A1Semiconductor package and method

Publication Date: 2023.12.28 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor package including one or more heat dissipation systems and a method of forming are provided. The semiconductor package may include one or more integrated circuit dies, an encapsulant surrounding the one or more integrated circuit dies, a redistribution structure over the one or more integrated circuit dies and the encapsulant. The redistribution structure may include one or more heat dissipation systems, which are electrically isolated from remaining portions of the redistribution structure. Each heat dissipation system may include a first metal pad, a second metal pad, and one or more metal vias connecting the first metal pad to the second metal pad.