Package structure, semiconductor device and manufacturing method thereof
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Solution Overview
Problem
3D integrated circuits (3DICs) face challenges with high heat density and poor thermal dissipation, leading to hot spots that affect electrical performance and cause electromigration and reliability issues.
Innovation Solution
Incorporating heat-conductive dielectric materials like aluminum nitride and boron nitride in redistribution layers, along with thick electrically conductive layers, to create efficient heat dissipation paths in 3DICs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chip density is increased in 3DICs, then productivity and integration are improved, but heat dissipation performance deteriorates and hot spots are generated
Solution Approach 1:
The patent applies local quality by implementing a multi-layer redistribution layer structure with varying thicknesses and thermal conductivities at different locations. Inner redistribution layers closer to heat-generating devices have different properties than outer layers, creating localized thermal management zones that address hot spots while maintaining overall high chip density
Solution Approach 2:
The patent uses composite materials by combining multiple redistribution layer materials with different thermal conductivities (e.g., copper, aluminum, tungsten) and dielectric materials with varying thermal properties. This composite approach enables optimized heat dissipation paths through the package while maintaining electrical functionality and high integration density
2Device complexity
If heat is trapped in inner region of bottom stacked die, then device integration is achieved, but reliability deteriorates due to hot spots causing electromigration
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional thermal management by implementing vertical redistribution layers that extend through multiple stacked dies. This multi-dimensional approach creates additional heat escape paths from inner die regions through outer dies to heat sinks, reducing hot spots while maintaining complex 3D integration
Solution Approach 2:
The redistribution layers act as intermediary thermal conduits between heat-generating devices in inner dies and heat dissipation structures in outer dies. These intermediate layers transfer heat laterally and vertically, preventing direct heat trapping in inner regions while maintaining the integrated stacked die structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal dissipation, maintaining chip operating temperatures within a desirable range, improving performance and preventing electromigration and reliability issues.
Implementation Method 1
one or more dielectric layers filled with a heat conductive dielectric material
Data Source
AI summary
A package structure includes a solder feature, a first redistribution layer structure on the solder feature, and a die mounted on and electrically coupled to the first redistribution layer structure. The first redistribution layer structure includes one or more dielectric layers filled with a heat conductive dielectric material.