Redistribution Layer Thin Coating for Oxidation Protection
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Solution Overview
Problem
The existing manufacturing processes for integrated circuits face challenges in protecting the redistribution layer's conductive regions from oxidation and corrosion, particularly during electrical testing, which can lead to degradation and delamination issues, limiting the types of tests that can be performed and affecting the reliability of the ICs.
Innovation Solution
A redistribution layer is manufactured with a thin coating region made of insulating materials like Aluminum or Hafnium, deposited using atomic layer deposition (ALD), which provides protection against oxidation and corrosion, allowing for high-temperature testing without damage and preventing delamination by adhering directly to the conductive region without intermediate layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the conductive region is exposed for electrical testing, then testing can be performed, but the conductive region is susceptible to oxidation and corrosion
Solution Approach 1:
A thin coating region is deposited on the conductive region before electrical testing to provide protection against oxidation and corrosion. This preliminary protective action allows the conductive region to be exposed for testing without suffering from harmful environmental factors.
Solution Approach 2:
The thin coating region creates an inert barrier between the conductive region and the external environment, effectively isolating the conductive region from oxidizing and corrosive atmospheric conditions during electrical testing and storage.
2Object-affected harmful factors
If a thick protective coating is applied to prevent oxidation, then protection is improved, but the complexity of the manufacturing process increases
Solution Approach 1:
The thickness of the coating region is optimized to be thin (nanometer to sub-micrometer scale) rather than thick, providing sufficient protection against oxidation and corrosion while minimizing the impact on manufacturing process complexity and maintaining electrical testability.
Solution Approach 2:
The coating region is formed using composite material structures deposited by atomic layer deposition, combining multiple functional properties (protection, adhesion, testability) in a single integrated layer that simplifies the overall manufacturing process.
3Strength
If intermediate layers are used between the coating and conductive region, then adhesion is improved, but the risk of delamination increases
Solution Approach 1:
The patent eliminates intermediate adhesion layers between the thin coating region and the conductive region, relying on direct adhesion of the coating to the conductive surface. This reduction in layer count minimizes potential delamination interfaces while maintaining sufficient adhesion strength.
Solution Approach 2:
The coating material is selected to inherently adhere directly to the conductive region material without requiring separate adhesion-promoting intermediate layers. The coating formulation and deposition process are optimized to create strong self-adhesion to the conductive surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents corrosion and oxidation, enabling reliable electrical testing at various temperatures and reducing the risk of delamination, thus improving the stability and reliability of the integrated circuits during manufacturing and usage.
Implementation Method 1
A thin coating region made of insulating materials like Aluminum or Hafnium, deposited using atomic layer deposition (ALD)
Data Source
AI summary
A redistribution layer for an integrated circuit is made by forming a conductive interconnection layer; forming a conductive body in electrical contract with the interconnection layer; and covering the conductive body with a first coating layer having a thickness less than 100 nm. The first coating layer is configured to provide a protection against oxidation and/or corrosion of the conductive body. To carry out an electrical test of the integrated circuit, a testing probe locally perforates the first coating layer until the conductive body is electrically contacted by the testing probe.