Redistribution Layer Optoelectronics Without Bond Wires
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Solution Overview
Problem
Conventional optoelectronic devices are bulky and costly due to the use of many bond wires for electrical coupling, limiting their potential as portable health sensors.
Innovation Solution
An optoelectronic device design featuring a semiconductor chip with integrated circuit, light emitters, and detectors, coupled via a redistribution layer without bond wires, allowing for smaller package dimensions and reduced production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If bond wires are used to electrically couple components, then electrical connection is achieved, but device size increases and production costs increase
Solution Approach 1:
The patent merges the electrical coupling function into the substrate itself by creating conductive traces directly on the substrate surface. This eliminates the need for separate bond wires, thereby reducing package dimensions and simplifying the manufacturing process while maintaining electrical connectivity between components.
Solution Approach 2:
The patent extracts the bonding process entirely from the manufacturing workflow. By designing conductive traces that are pre-formed on the substrate, the complex wire bonding step is removed, reducing both production cost and manufacturing complexity while achieving the same electrical coupling function.
2Device complexity
If bond wires are used for electrical coupling, then components can be connected, but the number of components and complexity increase
Solution Approach 1:
The patent combines multiple functions into the substrate structure: mechanical support, electrical connection, and signal routing are all integrated into the substrate with its conductive traces. This eliminates the need for separate bond wires and reduces the overall component count and device complexity.
Solution Approach 2:
The substrate is designed to serve multiple functions simultaneously: it provides mechanical support for components, establishes electrical connections through conductive traces, and routes signals between different components. This multi-functionality reduces the need for additional specialized components like bond wires.
3Reliability
If conventional sensor design is used, then reliable electrical connection is achieved, but device size becomes bulky
Solution Approach 1:
The patent transitions from three-dimensional wire bonding to two-dimensional conductive traces on the substrate surface. This dimensional change reduces the vertical space required for electrical connections, enabling more compact device packaging while maintaining reliable electrical connectivity through the trace network.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables smaller, more portable devices with improved detection speed and electromagnetic interference robustness, while eliminating the need for wire bonding and reducing production costs.
Implementation Method 1
The at least one light emitter is configured to emit light during the operation of the optoelectronic device
Implementation Method 2
At least a portion of the emitted light can be detected by the at least one light detector
Implementation Method 3
The first redistribution layer electrically couples the semiconductor chip to the at least one light emitter and the at least one light detector
Data Source
Figure 1A~1I
Figure 1J~1P
Figure 2~3C
AI summary
An optoelectronic device (50) comprises a semiconductor chip (30), a first redistribution layer (25) arranged over the semiconductor chip (30), and at least one light emitter (11) and at least one light detector (12) arranged over the first redistribution layer (25), wherein the first redistribution layer (25) electrically couples the semiconductor chip (30) to the at least one light emitter (11) and the at least one light detector (12).