Redistribution Layer Dummy Bonding Pad for Wire Defect Detection
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Solution Overview
Problem
Conventional semiconductor package manufacturing processes for package-on-package (POP) technology face defects in the redistribution wire bonding process, leading to decreased product yields due to the inability to detect bonding wire defects before stacking the second package.
Innovation Solution
Incorporating a dummy bonding pad and wire in the redistribution wiring layer to form a closed dummy circuit, allowing for the detection of bonding wire defects before stacking the second package, ensuring that only defect-free wires are used for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a test process is performed after the second package is stacked on the first package, then the manufacturing process is simplified, but bonding wire defects cannot be detected before stacking, leading to decreased product yields
Solution Approach 1:
The patent applies preliminary action by performing the bonding wire test before stacking the second package. A dummy bonding pad and dummy bonding wire are provided on the first package, allowing the bonding wire to be tested for defects prior to the stacking process. This enables early detection of bonding wire issues, preventing defective wires from being used in the final product, thereby improving product yield while maintaining manufacturing simplicity.
2Productivity
If bonding wire defects are not detected before stacking, then the manufacturing process remains simple, but defects in the end product increase
Solution Approach 1:
The patent implements preliminary action by establishing a testing mechanism before the stacking process. The dummy bonding pad and dummy bonding wire configuration enables quality inspection of bonding wires prior to their use in critical connections. This preliminary quality check ensures that only defect-free bonding wires proceed to the stacking process, improving manufacturing precision without significantly impacting productivity.
Solution Approach 2:
The patent uses an intermediary approach by introducing a dummy bonding pad and dummy bonding wire as test structures. These intermediary elements serve as proxies for testing bonding wire quality without affecting the actual functional bonding wires. This allows for quality verification while maintaining the integrity and functionality of the real bonding connections.
3Reliability
If a dummy bonding pad and wire are added to the redistribution wiring layer, then bonding wire defects can be detected before stacking, but the device complexity increases
Solution Approach 1:
The patent applies segmentation by separating the testing function from the functional bonding function. The dummy bonding pad and dummy bonding wire are distinct from the actual bonding pads and bonding wires that connect to the second package. This segmentation allows the testing structures to be independently designed and configured without interfering with the functional connections, thereby limiting the increase in device complexity while achieving reliable defect detection.
Solution Approach 2:
The patent uses copying by creating a dummy bonding pad and dummy bonding wire that replicate the structure and electrical characteristics of the actual bonding pad and bonding wire. This copy serves as a test model that mimics the real bonding connection without being the actual functional connection. The copying approach allows for effective testing while keeping the additional complexity minimal, as the dummy structures are simple replicas rather than complex alternative solutions.
Data Source
AI summary
A semiconductor package includes a first package including a first substrate and at least one first semiconductor chip mounted on the first substrate, a redistribution wiring layer provided on the first package and including a connection pad, a bonding pad electrically connected to the connection pad and a dummy bonding pad electrically connected to the bonding pad, a second package stacked on the first package via the redistribution wiring layer and electrically connected to the connection pad of the redistribution wiring layer by a first connection member, a bonding wire electrically connecting the bonding pad to the first substrate, and a dummy bonding wire electrically connecting the dummy bonding pad to the first substrate.