Redistribution Layer Structure for Thermal Expansion Matching
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Solution Overview
Problem
The existing redistribution layer structures in electronic components face issues such as warping and peeling due to differences in thermal expansion coefficients between metal and dielectric layers, affecting the structural strength and manufacturing process yield.
Innovation Solution
A redistribution layer structure is designed with a first metal layer and a first dielectric layer, where the coefficient of thermal expansion of the dielectric layer matches that of the metal layer, within a range of 0% to 70% of the dielectric layer's coefficient, to minimize deformation and peeling during temperature changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the coefficient of thermal expansion of the dielectric layer is significantly different from that of the metal layer, then the manufacturing process is easier with conventional materials, but the redistribution layer structure experiences warping and peeling during temperature changes
Solution Approach 1:
The patent applies parameter changes by carefully selecting and controlling the coefficient of thermal expansion of the dielectric layer material to fall within a specific range (0% to 70% of the metal layer's coefficient). This parameter optimization resolves the contradiction by ensuring thermal compatibility between layers, preventing warping and peeling during temperature changes, while still allowing practical material selection and manufacturing processes
2Reliability
If the coefficient of thermal expansion of the dielectric layer is matched to the metal layer, then the probability of warping and peeling is reduced, but the material selection becomes more constrained
Solution Approach 1:
The patent applies local quality by focusing the material selection criteria specifically on the thermal expansion property of the dielectric layer that interfaces with the metal layer. Rather than constraining all material properties, it targets the specific local property (coefficient of thermal expansion) that causes the warping and peeling issue, allowing flexibility in other material characteristics while ensuring thermal compatibility at the critical interface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the probability of warping and peeling, enhancing the reliability, structural strength, and manufacturing process quality by matching the thermal expansion coefficients of the dielectric and metal layers.
Implementation Method 1
the coefficient of thermal expansion of the first dielectric layer and a coefficient of thermal expansion of the first metal layer is within a range of 0% to 70% of the coefficient of thermal expansion of the first dielectric layer
Data Source
AI summary
A redistribution layer structure is provided. The redistribution layer structure includes a first metal layer and a first dielectric layer disposed on the first metal layer. A range of a difference between a coefficient of thermal expansion of the first dielectric layer and a coefficient of thermal expansion of the first metal layer is 0% to 70% of the coefficient of thermal expansion of the first dielectric layer.