Redistribution Layer Insulation for Fan-Out Wiring Flexibility
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic devices with thick insulating layers face space constraints, limiting circuit wire placement and design flexibility, and compromising reliability due to the cramped space.
Innovation Solution
An electronic device design featuring a redistribution layer with a first insulating layer and a second insulating layer, where the first insulating layer has smaller filler particles for forming small openings and the second insulating layer has larger filler particles for increased tensile strength, allowing for improved fan-out circuit design and input/output wire flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick insulating layer is used to protect the electronic element, then the protection reliability is improved, but the space for circuit wire placement is constrained
Solution Approach 1:
The patent applies local quality by using different filler particle sizes in different insulating layers: the first insulating layer (near the electronic element) contains smaller filler particles to enable smaller opening formation for precise wire placement, while the second insulating layer (farther from the element) contains larger filler particles to provide enhanced mechanical strength and protection. This spatial differentiation of material properties resolves the contradiction between protection reliability and placement space.
2Reliability
If a thick insulating layer is used to protect the electronic element, then the protection reliability is improved, but the design flexibility is reduced
Solution Approach 1:
By implementing local quality with gradient filler particle sizes across different insulating layers, the patent enables both robust protection (through the overall thick layer structure with large particles) and design flexibility (through the smaller particle region that accommodates varied circuit wire configurations). The differentiated structure allows the insulating system to simultaneously provide mechanical protection and adaptability for different fan-out circuit designs.
3Manufacturing precision
If smaller filler particles are used in the first insulating layer, then the opening size is reduced for better wire placement, but the tensile strength is decreased
Solution Approach 1:
The patent resolves this contradiction by applying local quality: the first insulating layer uses smaller filler particles specifically in the regions where high precision opening formation is needed for wire placement, while the second insulating layer uses larger filler particles in regions where mechanical strength is the primary requirement. This spatial differentiation allows each layer to optimize for its specific function without compromising the other.
Solution Approach 2:
The patent applies segmentation by dividing the insulating structure into multiple layers with different filler particle characteristics. The first insulating layer is segmented to have smaller particles for precision, while the second insulating layer is segmented to have larger particles for strength. This segmentation allows the system to achieve both precision and strength that would be impossible in a single homogeneous layer.
4Strength
If larger filler particles are used in the second insulating layer, then the tensile strength is increased, but the opening formation capability is reduced
Solution Approach 1:
The patent applies local quality by restricting larger filler particles to the second insulating layer where mechanical strength is the primary requirement, while the first insulating layer uses smaller particles where opening formation precision is critical. This spatial differentiation ensures that each region of the insulating structure has the material properties optimized for its specific functional requirements.
Data Source
AI summary
An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.