Redistribution Layer Guard Layout for Via Spacing and Isolation
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Solution Overview
Problem
Existing chip-to-chip communication in semiconductor packages is not satisfactory in all aspects, particularly in terms of conductive feature complexity and efficiency, especially for I/O signals.
Innovation Solution
A redistribution layer with guard members is introduced, featuring a dielectric stack and conductive connections, where guard members are arranged around power/ground connections to reduce spacing and shield signal connections, enhancing electrical isolation and reducing noise coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If guard members are added around power/ground connections to shield signal connections, then electrical isolation and noise coupling reduction are improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The guard members are nested within the existing redistribution layer structure, positioned between the signal connections and power/ground connections. This nesting approach allows the guard members to be integrated into the existing conductive feature hierarchy without requiring separate isolation layers or additional structural elements, thereby improving electrical isolation while minimizing increases in device complexity
Solution Approach 2:
The guard members act as intermediary conductive elements positioned between signal connections and power/ground connections. These intermediary structures provide electrostatic shielding and electrical isolation by creating intermediate potential zones, reducing noise coupling while maintaining a relatively simple manufacturing process that builds upon existing redistribution layer fabrication techniques
2Area of stationary object
If spacing between conductive vias is reduced to improve chip area utilization, then device area usage is improved, but electrical isolation and noise coupling performance deteriorate
Solution Approach 1:
The guard members are nested within the available space between conductive vias, utilizing the vertical and lateral dimensions of the redistribution layer structure. This nesting allows effective noise shielding to be achieved within the constrained horizontal spacing, enabling reduced via spacing while maintaining electrical isolation through the vertically-integrated guard member structures
Solution Approach 2:
The solution moves the isolation function from the horizontal plane to the vertical dimension by implementing guard members as vertically-extending conductive structures. This dimensional transition allows noise shielding and electrical isolation to be achieved in the vertical space between signal and power/ground connections, enabling tighter horizontal spacing between conductive vias while maintaining noise coupling performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for reduced spacing between conductive vias while maintaining effective electrical isolation, thereby improving communication efficiency and reducing device area usage.
Implementation Method 1
guard members are arranged around power/ground connections to reduce spacing and shield signal connections, enhancing electrical isolation and reducing noise coupling
Data Source
AI summary
A redistribution layer, a semiconductor device, and a method of manufacturing the semiconductor device are provided. The redistribution layer includes a dielectric stack, a plurality of signal connections, a plurality of power/ground connections, and a plurality of guard members. The dielectric stack is disposed on the substrate. The plurality of signal connections penetrate through the dielectric stack. The plurality of power/ground connections extend through the dielectric stack. The plurality of guard members are disposed in the dielectric stake and arranged respectively around the plurality power/ground connections.