Redistribution Layer Layout for Semiconductor Latch-Up Protection
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Solution Overview
Problem
The increasing integration and packaging density of semiconductor devices leads to a higher likelihood of latch-up events, which can cause irreparable damage due to large current surges from parasitic silicon controlled rectifiers, necessitating improved layout designs or process technologies to enhance reliability.
Innovation Solution
Incorporating a latch-up protection circuit separated from the chip and connected via redistribution layers to prevent latch-up by diverting instantaneous current away from critical components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the latch-up protection circuit is integrated with the chip, then device complexity is reduced, but reliability deteriorates due to increased latch-up risk
Solution Approach 1:
The patent divides the semiconductor device into separate functional modules: the main chip and the latch-up protection circuit are fabricated on different substrates. This segmentation isolates the protection circuit from the main chip, reducing the risk of latch-up while maintaining device functionality. The redistribution layer serves as the interconnection medium between these segmented parts.
2Reliability
If the latch-up protection circuit is separated from the chip, then reliability is improved, but device complexity increases
Solution Approach 1:
The redistribution layer acts as an intermediary component that connects the latch-up protection circuit on the first substrate to the chip on the second substrate. This mediator enables signal transmission between separated functional blocks while maintaining a modular architecture that improves reliability without excessive complexity.
3Manufacturing precision
If the same manufacturing process is used for both chip and protection circuit, then manufacturing precision is maintained, but manufacturing cost increases
Solution Approach 1:
The patent applies different manufacturing process nodes to different functional blocks: the chip can be fabricated using an advanced process node for high performance, while the latch-up protection circuit uses a less advanced but more cost-effective process node. This local quality approach optimizes the cost-performance ratio by matching process complexity to functional requirements.
Data Source
AI summary
An embodiment of the present application provides a semiconductor device, including a substrate, a chip, a latch-up protection circuit, and a redistribution layer. The chip is on the substrate. The latch-up protection circuit is separated from the chip in a direction. The redistribution layer transmits a signal between the latch-up protection circuit and the chip.