Redistribution Layer Moisture Barrier for Copper Delamination Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face challenges in preventing moisture penetration, which can lead to oxidation of copper and delamination issues, particularly in redistribution layers, affecting the reliability and integrity of the package.
Innovation Solution
The implementation of a moisture-resistant layer with a specific composition and surface properties, created through an argon-containing plasma treatment, is applied alternately with polymer layers in the redistribution layer structure to effectively block moisture and prevent delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polymer layers are used in the redistribution layer structure, then the package structure is formed, but moisture penetration occurs leading to copper oxidation and delamination
Solution Approach 1:
A moisture-resistant layer is introduced as an intermediary barrier between the polymer layers and the copper conductors. This layer acts as a mediator that blocks moisture penetration while allowing the package structure to maintain its electrical and mechanical functions. The moisture-resistant layer is applied between the polymer layer and the copper conductor surface, creating a protective interface that prevents direct contact between moisture and copper.
Solution Approach 2:
The package structure employs a composite material system consisting of multiple layers with different functional properties: polymer layers for structural support and insulation, moisture-resistant layers for barrier protection, and copper layers for electrical conduction. This composite structure combines the advantages of each material while mitigating their individual weaknesses, particularly the moisture sensitivity of copper and the need for structural integrity.
2Reliability
If copper is used in the redistribution layer, then electrical conductivity is achieved, but oxidation occurs when moisture penetrates
Solution Approach 1:
The moisture-resistant layer serves as a protective intermediary between the copper conductor and the moisture-containing environment. This barrier layer prevents moisture from reaching the copper surface, thereby eliminating the oxidation reaction while maintaining the copper's electrical conductivity. The intermediary layer allows electrical signals to pass through via capacitive coupling or through designated contact points while blocking moisture transport.
Solution Approach 2:
The moisture-resistant layer functions as a hydraulic barrier, blocking the transport of moisture molecules through the package structure. By creating a continuous impermeable layer over the copper conductor, it prevents the diffusion of water vapor and liquid moisture to the copper surface, thereby preventing oxidation while allowing the electrical function to persist.
3Reliability
If multiple layers are added to prevent moisture, then moisture resistance improves, but device complexity increases
Solution Approach 1:
The package structure is segmented into distinct functional layers: polymer layers for structural support, moisture-resistant layers for barrier protection, and copper layers for electrical conduction. Each layer is optimized for its specific function, and the segmentation allows for independent optimization of each component while maintaining overall system performance. The moisture-resistant layers are strategically placed only where needed to protect copper conductors.
Solution Approach 2:
The moisture-resistant layers are applied locally only in areas where copper conductors are present and require protection, rather than covering the entire package structure uniformly. This localized application reduces the overall complexity and material usage while providing targeted protection where it is most needed. The polymer layers continue to provide general structural support without requiring moisture-resistant modifications in all areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the package's resistance to moisture ingress, preventing copper oxidation and delamination, thereby improving the reliability and integrity of the semiconductor package during thermal processes and reliability tests.
Implementation Method 1
created through an argon-containing plasma treatment
Data Source
AI summary
A semiconductor structure and a method of forming the same are disclosed. A method of forming a semiconductor structure includes the following operations. An insulating layer is formed over a substrate. A metal feature is formed in the insulating layer. An argon-containing plasma treatment is performed to the insulating layer and the metal feature.