Redistribution Layer Recognition Marks for Bonding Pad Detection
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Solution Overview
Problem
Existing semiconductor devices face challenges in accurately identifying the positions of bonding pad portions during the wire bonding process due to the similarity in appearance between the bonding pad portions and the redistribution layer patterns, leading to potential defects.
Innovation Solution
Incorporation of recognition marks, such as trench portions or opening portions, on the redistribution layer patterns that provide a distinct visual contrast or color to highlight the bonding pad positions, enabling precise detection and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If bonding pad portions and redistribution layer patterns have similar appearance, then manufacturing complexity is reduced, but measurement precision of bonding pad positions deteriorates
Solution Approach 1:
The patent applies color/reflectivity changes by forming a recognition mark with different reflectivity characteristics than the surrounding redistribution layer patterns. This allows the bonding pad position to be visually distinguished during wire bonding processes while maintaining structural simplicity. The recognition mark creates optical contrast without adding complex structural elements.
Solution Approach 2:
The recognition mark serves as an intermediary element between the bonding pad portion and the detection system. It provides a visual reference that mediates the identification process, enabling accurate positioning without requiring direct observation of the bonding pad itself. This intermediary mark resolves the identification difficulty while keeping the original bonding pad structure unchanged.
2Measurement precision
If recognition marks are added to delineate bonding pad positions, then measurement precision improves, but device complexity increases
Solution Approach 1:
The recognition mark utilizes reflectivity or color differences rather than complex structural additions. By varying the optical properties (reflectivity, absorption) of the mark material compared to the redistribution layer, the patent achieves high visibility for positioning purposes while maintaining a relatively simple planar structure that adds minimal complexity to the device.
Solution Approach 2:
The recognition mark is implemented as a localized feature with specific optical properties only where needed for identification. The rest of the device maintains its original structure and materials. This local differentiation allows precision improvement without requiring global structural changes, thus limiting the increase in overall device complexity.
Data Source
AI summary
A semiconductor device includes a first redistribution layer pattern, a second redistribution layer pattern, and a recognition mark. The first redistribution layer pattern is formed on a semiconductor substrate. The second redistribution layer pattern, with a bonding pad portion, is disposed on the first redistribution layer pattern. Furthermore, the recognition mark is formed on the first redistribution layer pattern to indicate a position of the bonding pad portion.