Redistribution Layer Package Layout for Flexible Pad Pitch
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Solution Overview
Problem
Existing semiconductor packages face challenges in standardization, miniaturization, and compatibility, which affect their operating speeds and electrical connections.
Innovation Solution
A semiconductor package is designed with a redistribution layer that includes first redistribution pads on one surface and a semiconductor chip on the opposing surface, along with conductive structures and external connection terminals, allowing for flexible pitch arrangements and improved electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If bonding wires or bumps are used to electrically connect the semiconductor chip to the printed circuit board, then electrical connections are established, but the operating speed and compatibility are limited
Solution Approach 1:
The patent transitions from traditional wire/bump connections in three-dimensional space to planar pad-to-pad electrical connections through the redistribution layer. The conductive structures extend laterally from the chip pads to the external terminals, eliminating the need for vertical wire bonds or solder bumps, thereby improving operating speed while simplifying the connection structure.
Solution Approach 2:
The redistribution layer serves as an intermediary structure between the semiconductor chip and the external circuit board. It includes conductive structures that redistribute electrical connections from the chip pads to externally accessible terminals, enabling faster signal transmission and improved compatibility without direct wire or bump connections.
2Volume of moving object
If the pitch of external connection terminals is reduced for miniaturization, then package size is reduced, but manufacturing precision and alignment difficulty increase
Solution Approach 1:
The patent divides the connection structure into multiple segments: chip pads on the semiconductor chip, conductive structures within the redistribution layer, and external terminals on the circuit board. This segmentation allows each component to be manufactured and positioned independently, then assembled together, reducing the overall package size while maintaining manageable manufacturing precision requirements for each segment.
Solution Approach 2:
The redistribution layer extends connections in the lateral plane rather than vertically, allowing pitch reduction in the horizontal direction without proportionally increasing alignment difficulty. The conductive structures are formed as planar patterns that can be precisely positioned using standard photolithography techniques, enabling miniaturization while maintaining manufacturing feasibility.
3Adaptability or versatility
If standardization of semiconductor packages is pursued, then compatibility improves, but flexibility in pitch arrangement is reduced
Solution Approach 1:
The redistribution layer is designed as a universal interface that can accommodate different chip pad configurations and external terminal arrangements. The conductive structures can be patterned in various layouts to match different application requirements, allowing a single package structure to serve multiple functions and applications while maintaining improved compatibility through standardized connection interfaces.
Data Source
AI summary
A semiconductor package includes a redistribution layer having a first surface and a second surface opposite to each other, the redistribution layer including a plurality of first redistribution pads on the first surface, a semiconductor chip on the second surface of the redistribution layer, an active surface of the semiconductor chip facing the redistribution layer, a plurality of conductive structures on the second surface of the redistribution layer, the plurality of conductive structures being spaced apart from the semiconductor chip, and a plurality of external connection terminals on and coupled to the conductive structures, the plurality of first redistribution pads have a pitch smaller than a pitch of the plurality of external connection terminals.