Redistribution Layer Conductive Pattern Layout for Package Reliability
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Solution Overview
Problem
The reliability of redistribution circuit structures in integrated fan-out packages is a concern due to the potential for conductor material to flow into the main portion of the metallization layer, affecting the integrity of the package structure.
Innovation Solution
The use of conductive patterns with specific configurations, such as conductive patterns electrically isolated from the main portion by slits and protrusions, prevents conductor material from flowing into the metallization layer, ensuring the reliability of the package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductor material is used in the metallization layer, then electrical connectivity is achieved, but conductor material may flow into the main portion of the metallization layer, compromising structural integrity
Solution Approach 1:
The conductive pattern is segmented into distinct portions (first portion, second portion, and connecting portion) that are electrically isolated from the main portion of the metallization layer through slits. This segmentation prevents conductor material from flowing into the main portion while maintaining electrical connectivity through the isolated conductive pattern structure.
Solution Approach 2:
The connecting portion acts as an intermediary element that electrically connects the first and second portions of the conductive pattern while being physically isolated from the main portion by slits. This intermediary structure enables electrical connectivity without allowing conductor material to mix with the main metallization layer.
2Reliability
If conductive patterns are electrically isolated from the main portion by slits, then electrical isolation is achieved, but the complexity of the metallization layer structure increases
Solution Approach 1:
The metallization layer is segmented into a main portion and isolated conductive patterns with connecting portions, separated by slits. This segmentation achieves electrical isolation while maintaining a systematic structure that can be manufactured using standard photolithography and etching processes.
Solution Approach 2:
Different regions of the metallization layer have different properties: the main portion provides overall structural support, while the isolated conductive patterns with connecting portions provide localized electrical connectivity. The slits create local discontinuities that enable electrical isolation where needed while maintaining continuity elsewhere.
Data Source
AI summary
A package structure includes an insulating encapsulation, a semiconductor die, and a redistribution circuit structure. The semiconductor die is encapsulated in the insulating encapsulation. The redistribution circuit structure includes conductive patterns, wherein the conductive patterns each comprise a first portion, at least one second portion, and at least one connecting portion. A first edge of the at least one connecting portion is connected to the first portion, and a second edge of the at least one connecting portion is connected to the at least one second portion, wherein the first edge is opposite to the second edge, and a length of the first edge is greater than a length of the second edge.