Redistribution Layer Ground-Signal Layout for RF Isolation
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Solution Overview
Problem
Semiconductor devices face issues with electromagnetic interference and crosstalk due to undesired interactions between adjacent communication channels and the semiconductor substrate, which affect performance and reliability.
Innovation Solution
The semiconductor device incorporates an electrical redistribution layer with a ground line connected to a ground potential and a signal line, where the gap between them is minimized in width to less than 10% of the signal wavelength and consistently smaller than 40 micrometers, with specific positional alignment to reduce electromagnetic interference and enhance isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the gap between ground line and signal line is reduced to less than 10% of wavelength and smaller than 40 micrometers, then electromagnetic interference is reduced and RF isolation is improved, but manufacturing precision requirements are significantly increased
Solution Approach 1:
The patent applies parameter changes by optimizing the gap width to be continuously smaller than 10% of the signal wavelength and at least smaller than 40 micrometers along the specified path. This quantitative parameter optimization reduces electromagnetic interference while maintaining manufacturability through defined thresholds.
Solution Approach 2:
The patent implements local quality by applying the minimal gap requirement specifically along the path from the electrical contact to the external connection element, where electromagnetic interference is most critical, rather than uniformly across the entire redistribution layer. This localized approach focuses precision requirements where they are most needed.
2Reliability
If the gap width is minimized to reduce crosstalk and electromagnetic interference, then signal isolation between channels is improved, but the complexity of the manufacturing process increases
Solution Approach 1:
The patent changes the gap width parameter to be continuously smaller than 10% of the wavelength and at least smaller than 40 micrometers, which improves signal isolation between channels while providing clear manufacturing specifications that balance reliability with ease of manufacture.
Solution Approach 2:
The patent applies partial action by enforcing the minimal gap requirement only along the specific path from electrical contact to external connection element, rather than across the entire device. This partial application of the constraint achieves the necessary isolation without unnecessarily complicating the overall manufacturing process.
3Object-generated harmful factors
If the gap between ground line and signal line is reduced, then electromagnetic field confinement is improved and crosstalk is reduced, but the manufacturing precision and alignment requirements are increased
Solution Approach 1:
The patent optimizes the gap width parameter to be continuously smaller than 10% of the wavelength and at least smaller than 40 micrometers along the path, which confines electromagnetic fields and reduces crosstalk while providing measurable thresholds that guide manufacturing precision requirements.
Solution Approach 2:
The patent applies the minimal gap requirement partially, only along the critical path from electrical contact to external connection element where crosstalk is most problematic. This selective application reduces the overall alignment precision burden compared to requiring minimal gaps across the entire redistribution layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces electromagnetic interference, increases RF isolation, and minimizes coupling between channels and the substrate, leading to improved performance and reliability by confining electromagnetic fields and reducing crosstalk.
Implementation Method 1
a width of a gap between the ground line and the signal line is continuously smaller than 10 percent of the wavelength and at least smaller than 40 micrometers along a path... effectively reduces electromagnetic interference, increases RF isolation, and minimizes coupling between channels and the substrate, leading to improved performance and reliability by confining electromagnetic fields and reducing crosstalk
Data Source
AI summary
A semiconductor device includes a semiconductor chip including an electrical contact arranged on a main surface of the semiconductor chip, an external connection element configured to provide a first electrical connection between the semiconductor device and a printed circuit board, and an electrical redistribution layer extending in a direction parallel to the main surface of the semiconductor chip and configured to provide a second electrical connection between the electrical contact of the semiconductor chip and the external connection element. The electrical redistribution layer includes a ground line connected to a ground potential and a signal line configured to carry an electrical signal having a wavelength.