Redistribution Layer for Semiconductor Die Stacking
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Solution Overview
Problem
Conventional methods for forming stacked electronic packages, such as those using support bonding wires, are inadequate in reducing manufacturing cost and complexity, especially when dealing with fine-pitch semiconductor devices and through-silicon via (TSV) processes.
Innovation Solution
A semiconductor device and manufacturing method that involves bonding a second semiconductor die to a first semiconductor die with a through silicon via (TSV) using a redistribution layer, which extends around the side portions of the second die, eliminating the need for solder and reducing the accuracy required for TSV and bond pad matching, thereby minimizing manufacturing costs and avoiding thermal processes that could damage the wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional support bonding wires are used to form stacked electronic packages, then electrical connection between semiconductor die can be achieved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent removes the support bonding wire from the stacking process entirely. Instead, the redistribution layer itself performs the electrical connection function between stacked semiconductor die, eliminating the need for separate support bonding wires and reducing manufacturing complexity
Solution Approach 2:
The redistribution layer serves multiple functions: it redistributes electrical signals within the semiconductor die and simultaneously provides the electrical connection between stacked die. This multi-functionality eliminates the need for separate support bonding wires
2Speed
If through silicon via (TSV) process is used with fine pitch, then high speed operation and miniaturization are achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the TSV formation process with the redistribution layer formation process. The redistribution layer is formed to extend around the side portions of the semiconductor die, integrating the electrical connection function with the signal redistribution function, thereby simplifying manufacturing
3Reliability
If solder is used to bond semiconductor die, then electrical connection is achieved, but device lifetime decreases and thermal damage risk increases
Solution Approach 1:
The patent replaces solder with a redistribution layer made of copper or other metals that do not require thermal processing. This eliminates the thermal damage associated with soldering and extends device lifetime, though it uses a different material approach
Data Source
AI summary
Various aspects of the present disclosure provide a semiconductor device and a method for manufacturing thereof, which can facilitate stacking of semiconductor die while saving manufacturing cost. In an example embodiment, the semiconductor device may comprise a first semiconductor die, a second semiconductor die bonded to a top surface of the first semiconductor die, and a redistribution layer electrically connecting the first semiconductor die to the second semiconductor die, wherein the redistribution layer is formed to extend along surrounding side portions of the second semiconductor die.