Redistribution-Layer Optoelectronic Sensor Packaging Without Bond Wires
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Solution Overview
Problem
Conventional optoelectronic devices are bulky and costly due to the use of many bond wires for electrical coupling, limiting their potential as portable health sensors.
Innovation Solution
An optoelectronic device design featuring a semiconductor chip with integrated circuit, a redistribution layer, and light emitters and detectors, eliminating the need for bond wires and enabling smaller package dimensions and reduced production costs, with a method using embedded wafer level ball grid array technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If bond wires are used to electrically couple components, then electrical connections can be established, but the device becomes bulky and production costs increase
Solution Approach 1:
The patent merges the electrical coupling function into the substrate itself by creating conductive traces directly on the substrate surface. This eliminates the need for separate bond wires, thereby reducing package dimensions and simplifying the manufacturing process while maintaining electrical connectivity between components.
Solution Approach 2:
The patent extracts the bonding process entirely from the manufacturing workflow. By designing conductive traces that are pre-formed on the substrate, the complex wire bonding step is removed, reducing both production cost and manufacturing complexity while achieving smaller package dimensions.
2Device complexity
If multiple bond wires are used for electrical coupling, then all components can be connected, but the number of components and complexity increase
Solution Approach 1:
The patent merges multiple individual wire connections into a single integrated conductive trace network on the substrate. This consolidation reduces the number of discrete components, simplifies the device structure, and lowers production costs by eliminating multiple bonding operations.
Solution Approach 2:
The substrate's conductive traces serve multiple functions simultaneously: they provide electrical connections between multiple components, act as structural support, and define the overall device layout. This multi-functionality reduces the need for separate bonding components and simplifies manufacturing.
3Reliability
If conventional sensor design is used, then reliable electrical connections are achieved, but the device size becomes large
Solution Approach 1:
The patent transitions from three-dimensional wire bonding to two-dimensional conductive traces on the substrate surface. This dimensional change allows electrical connections to be made in-plane rather than through vertical wire bonds, significantly reducing package height and overall device volume while maintaining connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact, cost-effective device with improved detection speed and electromagnetic interference robustness, suitable for vital sign measurement and integration into portable electronic devices.
Implementation Method 1
The at least one light emitter is configured to emit light during the operation of the optoelectronic device. At least a portion of the emitted light can be detected by the at least one light detector.
Implementation Method 2
A portion of the emitted light may also be absorbed by the environment of the optoelectronic device. For example, the optoelectronic device may be configured as a vital sign sensor. In this case, the at least one light emitter emits light towards the skin of a human or an animal. The emitted light is partially absorbed by the blood of the human or animal.
Data Source
AI summary
An optoelectronic device may include a semiconductor chip, a first redistribution layer arranged over the semiconductor chip, and at least one light emitter and at least one light detector arranged over the first redistribution layer. The first redistribution layer may electrically couple the semiconductor chip to the light emitter(s) and the light detector(s).