Integrated Shunt Resistor in Redistribution Layer for Current Sensing
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Solution Overview
Problem
Current high precision current measurement solutions, such as discrete shunt resistors, are cost-intensive and require additional components for temperature compensation, which poses layout and cost restrictions in applications like battery charging and motor control.
Innovation Solution
An electronic device with a semiconductor chip embedded in a package, incorporating a shunt resistor formed by external contact elements on a redistribution metallization layer, integrated with a temperature sensor and analog-to-digital converters to calculate current based on voltage differences, allowing for precise current measurement without the need for additional temperature compensation components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If discrete shunt resistors are used for high precision current measurement, then measurement precision is improved, but device complexity and cost increase due to additional temperature compensation components
Solution Approach 1:
The patent combines the shunt resistor and temperature sensor into a single integrated structure on the same substrate. The temperature sensor is positioned adjacent to the shunt resistor to directly measure the temperature at the measurement location, eliminating the need for separate temperature compensation components and reducing overall device complexity while maintaining measurement precision
Solution Approach 2:
The integrated structure serves multiple functions: the shunt resistor performs current measurement while the adjacent temperature sensor simultaneously measures temperature for compensation purposes. This multi-functional integration reduces the number of discrete components needed and simplifies the overall device architecture
2Measurement precision
If discrete shunt resistors with temperature compensation are used, then measurement precision is improved, but manufacturing cost increases
Solution Approach 1:
By merging the shunt resistor and temperature sensor into a single integrated structure fabricated on the same substrate using compatible processes, the patent reduces component count and assembly steps, thereby lowering manufacturing costs while maintaining high measurement precision through integrated temperature compensation
3Measurement precision
If discrete shunt resistors with temperature compensation components are used, then measurement precision is improved, but layout flexibility is reduced
Solution Approach 1:
The integration of the temperature sensor adjacent to the shunt resistor on the same substrate creates a compact self-contained module that requires minimal external components and interconnections, thereby improving layout flexibility and adaptability for various application configurations while maintaining measurement precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise current measurement with reduced costs and layout constraints by integrating temperature sensing and calculation within the semiconductor chip, eliminating the need for external temperature compensation components.
Implementation Method 1
a shunt resistor formed by external contact elements on a redistribution metallization layer, integrated with a temperature sensor and analog-to-digital converters to calculate current based on voltage differences
Implementation Method 2
The temperature sensor is integrated into the semiconductor chip in such a manner that an upper surface of the temperature sensor is adjacent to or coplanar with an upper surface of the shunt resistor
Data Source
AI summary
The electronic device for sensing a current comprises a semiconductor chip comprising a main face, an electronic circuit integrated in the semiconductor chip, a redistribution metallization layer disposed above the main face of the semiconductor chip, a current path formed in the redistribution metallization layer, the current path forming a resistor that is connected at two resistance defining end points to the electronic circuit for sensing a current flowing through the current path, and external contact elements connected with the redistribution metallization layer for feeding a current to be sensed into the current path.