Semiconductor Package Redistribution Layer Stack Height Reduction

Solution Overview

Problem

The existing semiconductor package technologies face challenges in reducing the size and thickness of semiconductor packages while minimizing the number of fabrication processes, particularly due to the use of spacer tape which increases stack height and complicates the manufacturing process.

Innovation Solution

A semiconductor package apparatus with a redistribution layer that allows for stacking semiconductor chips in a step shape, eliminating the need for spacer tape by using redistribution layers to facilitate electrical connections directly to external terminals, thereby reducing the stack height and simplifying the fabrication process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If spacer tape is used between semiconductor chips to secure space for wire bonding, then wire bonding space is secured, but stack height increases and fabrication process complexity increases

Engineering Contradiction:

Improvewire bonding spaceVSAvoidstack height

Core Design Contradiction:

Ease of operationVSLength of stationary object

Solution Approach 1:

The invention extracts and eliminates the spacer tape component from the package structure. By removing this unnecessary intermediate element, the chips can be stacked directly without requiring additional vertical space, thereby reducing stack height while maintaining wire bonding capability through direct chip-to-chip contact.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the functions of multiple components into a simplified structure. The support part integrates the functions of both mechanical support and electrical connection, eliminating the need for separate spacer tape. This consolidation reduces the number of fabrication processes and simplifies the overall package structure.

Inventive Principle:

Principle #5Merging (Combining)

2Ease of operation

If spacer tape is used between semiconductor chips, then wire bonding space is secured, but number of fabrication processes increases

Engineering Contradiction:

Improvewire bonding spaceVSAvoidnumber of fabrication processes

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The invention extracts and eliminates the spacer tape component from the package structure. By removing this unnecessary intermediate element, the chips can be stacked directly without requiring additional vertical space, thereby reducing stack height while maintaining wire bonding capability through direct chip-to-chip contact.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the functions of multiple components into a simplified structure. The support part integrates the functions of both mechanical support and electrical connection, eliminating the need for separate spacer tape. This consolidation reduces the number of fabrication processes and simplifies the overall package structure.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If traditional packaging structure is used with spacer tape, then chip protection is achieved, but package size and thickness increase

Engineering Contradiction:

Improvechip protectionVSAvoidpackage size

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The invention extracts and eliminates the spacer tape component from the package structure. By removing this unnecessary intermediate element, the chips can be stacked directly without requiring additional vertical space, thereby reducing stack height while maintaining wire bonding capability through direct chip-to-chip contact.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention employs thin film structures, particularly in the support part and redistribution layers, to provide necessary mechanical support and electrical connectivity without adding significant thickness. This allows for compact packaging while maintaining chip protection and electrical functionality.

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS8129826B2Semiconductor package apparatus having redistribution layer

Publication Date: 2012.03.06 SAMSUNG ELECTRONICS CO LTD

AI summary

Provided is a semiconductor package apparatus having a redistribution layer. The apparatus includes at least one or more semiconductor chips, a packing part protecting the semiconductor chips, and a support part supporting the semiconductor chips. The apparatus also includes external terminals extending outside the packing part, redistribution layers installed between the semiconductor chips and the support part and including redistribution paths, first signal transmitting units, and second signal transmitting units. The first signal transmitting units transmitting electrical signals generated from the semiconductor chips to the redistribution paths of the redistribution layers, and the second signal transmitting units transmit the electrical signals from the redistribution paths to the external terminals. Therefore, a size and a thickness of the semiconductor package apparatus can be reduced, and processes can be simplified to improve productivity.