Redistribution Layer Test Mark for Warpage Inspection
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Solution Overview
Problem
In packaging technology, the mismatched coefficients of thermal expansion between carriers and redistribution layers or between layers of the redistribution layer lead to warpage issues, affecting the quality and yield of package devices, as there is no real-time inline inspection method to determine warpage degrees or tendencies.
Innovation Solution
A package device with a redistribution layer that includes a test mark featuring a conductive pattern, allowing for real-time inspection of warpage by comparing variations in the conductive patterns' shapes, sizes, and positions, enabling improved process monitoring and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If real-time inline inspection is implemented to monitor warpage, then manufacturing precision and quality control are improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent uses optical copying to create an image of the test mark on the carrier substrate. This optical copy is then analyzed to detect warpage, replacing complex physical measurement systems with a simpler optical imaging approach that maintains high measurement precision while reducing system complexity
Solution Approach 2:
The test mark structure with its specific pattern serves as an intermediary element between the carrier substrate and the inspection system. This intermediary allows the optical system to indirectly measure warpage through the test mark's position and shape changes, simplifying the overall measurement process
2Measurement precision
If test marks are added to monitor warpage, then measurement capability is improved, but manufacturing process complexity increases
Solution Approach 1:
The test mark structure is merged with the existing carrier substrate manufacturing process. The test mark is formed as part of the substrate structure itself rather than as a separate added component, allowing warpage measurement capability to be integrated into the existing manufacturing flow without significantly increasing process complexity
Solution Approach 2:
The test mark structure serves multiple functions: it provides mechanical support as part of the carrier substrate while simultaneously serving as the measurement target for warpage detection. This multi-functionality eliminates the need for separate measurement fixtures or markers, reducing overall manufacturing complexity
Data Source
AI summary
The present disclosure provides a package device including a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.