Redistribution Layer Through Openings Prevent Delamination

The patent applies local quality by forming through openings at specific locations within the conductive trace (widened portion) to expose the underlying first passivation layer. This localized modification allows the second passivation layer to bond directly to the first passivation layer at these through opening sites, creating strong bonding points precisely where needed to prevent delamination, while maintaining the overall widened structure for electrical performance.

The first passivation layer acts as an intermediary between the metal redistribution layer and the second passivation layer. By forming through openings that expose the first passivation layer, the patent creates an intermediate bonding interface that mediates the connection between the metal and non-metal layers, enabling reliable bonding without direct metal-to-passivation contact that would cause delamination.

The patent applies preliminary action by forming the through openings in the conductive trace during the same fabrication step where the second passivation layer is deposited. The openings are pre-formed to expose the first passivation layer before the second passivation layer is applied, ensuring that bonding occurs automatically during the standard passivation layer formation process without requiring additional complex manufacturing steps.

The patent merges the through opening formation with the existing conductive trace fabrication process. The through openings are created as part of the same photolithography and etching sequence used to define the conductive trace pattern, combining multiple functions into a single integrated process step rather than adding separate complex manufacturing operations.