Redistribution Layer Stack for Warpage-Resistant Electronic Packaging
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Solution Overview
Problem
Existing electronic components face challenges in achieving good structural strength and quality due to varying manufacturing process conditions, leading to issues such as warping and peeling between metal and dielectric layers.
Innovation Solution
The electronic device incorporates a redistribution layer structure with alternating metal and dielectric layers, where the coefficients of thermal expansion of the dielectric and metal layers are matched to reduce deformation and warpage, and the Young's modulus of the dielectric layers is adjusted to enhance structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple alternating metal and dielectric layers are stacked to form a redistribution layer structure, then the structural strength and quality of the electronic device are improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The redistribution layer structure is divided into multiple alternating metal layers and dielectric layers, with each layer having specific thickness ranges and material properties. This segmentation allows independent optimization of each layer's characteristics to achieve overall structural strength while managing complexity through modular design
Solution Approach 2:
The patent employs composite material structure with at least two different dielectric materials having different Young's moduli arranged in alternating layers with metal layers. This composite approach enhances structural strength and warpage resistance by combining materials with complementary properties, while the systematic arrangement manages the complexity of multi-material integration
2Stability of the object's composition
If the Young's modulus of dielectric layers is adjusted to reduce warpage, then the structural integrity is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent specifies particular ranges for Young's modulus of different dielectric layers (first dielectric layer: 2-5 GPa, second dielectric layer: 3-7 GPa) to control warpage. By defining acceptable parameter ranges rather than exact values, the invention balances warpage control with manufacturing feasibility, allowing variation within specified limits
Solution Approach 2:
Different dielectric layers are assigned different Young's modulus values based on their specific positions and functions in the structure. The first dielectric layer has different mechanical properties than the second dielectric layer, allowing localized optimization of each layer's contribution to overall warpage resistance
3Reliability
If coefficients of thermal expansion of dielectric and metal layers are matched to reduce peeling, then the reliability is improved, but the material selection and manufacturing complexity increase
Solution Approach 1:
The patent specifies thermal expansion coefficient ranges for metal layers (10-20 ppm/°C) and dielectric layers (15-25 ppm/°C) to ensure matching between adjacent layers. By defining these parameter ranges, the invention facilitates material selection and manufacturing while achieving reliable peeling resistance through thermal expansion compatibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the reliability and structural strength of the electronic device by reducing warpage and peeling issues, while also enhancing manufacturing process yield and quality.
Implementation Method 1
A Young's modulus of the third insulating layer is less than a Young's modulus of the first insulating layer
Implementation Method 2
the coefficients of thermal expansion of the dielectric and metal layers are matched to reduce deformation and warpage
Data Source
AI summary
An electronic device includes a first metal layer, a first insulating layer disposed on the first metal layer, a second metal layer, a second insulating layer, a third metal layer, a third insulating layer, a fourth metal layer, a fourth insulating layer and an electronic component. The second metal layer is disposed on the first insulating layer. The second insulating layer is disposed on the second metal layer. The third metal layer is disposed on the second insulating layer. The third insulating layer is disposed on the third metal layer. The fourth metal layer is disposed on the third insulating layer. The fourth insulating layer is disposed on the fourth metal layer. The electronic component is disposed on the fourth insulating layer and electrically connected to the fourth metal layer. A Young's modulus of the third insulating layer is less than a Young's modulus of the first insulating layer.