Redistribution Layer Package Structure for Warpage Reduction
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Solution Overview
Problem
Electronic components face issues with warpage and structural integrity due to varying thermal expansion coefficients during manufacturing processes, leading to reduced manufacturing yield and quality.
Innovation Solution
A package structure with a redistribution layer design featuring dielectric layers with varying thermal expansion coefficients, where the first dielectric layer has a lower coefficient than subsequent layers, matching the substrate's expansion, thereby reducing deformation and residual stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If dielectric layers with uniform thermal expansion coefficients are used in the redistribution layer structure, then the manufacturing process is simple, but warpage occurs due to deformation difference during temperature changes
Solution Approach 1:
The patent applies local quality by assigning different thermal expansion coefficients to different dielectric layers based on their position. The first dielectric layer (closer to substrate) has a lower thermal expansion coefficient matching the substrate, while the second dielectric layer has a higher thermal expansion coefficient. This localized differentiation resolves the warpage issue caused by uniform thermal expansion properties.
Solution Approach 2:
The patent changes the thermal expansion coefficient parameter across different dielectric layers. By selecting materials with progressively different thermal expansion coefficients (first layer: lower CTE matching substrate, second layer: higher CTE), the patent optimizes the thermal-mechanical properties of each layer to minimize deformation differences during manufacturing temperature cycles.
2Manufacturing precision
If multiple dielectric layers with different thermal expansion coefficients are used to reduce warpage, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The patent segments the dielectric layers into multiple distinct layers (first dielectric layer and second dielectric layer) with different thermal expansion coefficients. This segmentation allows each layer to be optimized independently for its specific thermal-mechanical requirements, reducing overall structure warpage while maintaining manageable complexity through functional differentiation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design minimizes warpage and enhances structural strength and manufacturing process yield by aligning thermal expansion coefficients, ensuring better structural integrity and cost-effective production.
Implementation Method 1
A coefficient of thermal expansion of the first dielectric layer is less than a coefficient of thermal expansion of the second dielectric layer. In this way, the first dielectric layer with lower coefficient of thermal expansion can be matched with the substrate with lower coefficient of thermal expansion. Therefore, the deformation difference caused by the rising and falling temperatures during the manufacturing process may be reduced.
Implementation Method 2
the coefficients of thermal expansion of each of the multiple dielectric layers in the redistribution layer structure can be arranged to gradually increase in an order of bottom to top, which can reduce the deformation difference between different dielectric layers. An impact of residual stress may be reduced.
Data Source
AI summary
A package structure includes a substrate, a redistribution layer structure and an electronic component. The redistribution layer structure is disposed on the substrate. The electronic component is disposed on the redistribution layer structure. The redistribution layer structure includes a first dielectric layer, a second dielectric layer and at least one metal layer. The at least one metal layer is disposed between the first dielectric layer and the second dielectric layer. The first dielectric layer is closer to the substrate than the second dielectric layer. A coefficient of thermal expansion of the first dielectric layer is less than a coefficient of thermal expansion of the second dielectric layer.