Redistribution Package Structure for Fine-Pitch Solder Bump Isolation
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Solution Overview
Problem
The development of semiconductor packages with fine pitch input/output terminals is limited by the risk of short circuits between solder bumps, which restricts the design and reliability of these components.
Innovation Solution
A semiconductor package design featuring a redistribution structure with insulating layers and tapered bump structures, along with solder bumps and through-vias, enhances reliability by maintaining a standoff height and refining pitch between solder bumps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the pitch of input/output terminals and solder bumps is reduced to achieve finer design, then the device density and integration are improved, but the risk of short circuits between solder bumps increases
Solution Approach 1:
The patent introduces bump structures as intermediary elements between the solder bumps and the redistribution structure. These bump structures include insulating layers that act as mediators to electrically isolate adjacent solder bumps, preventing short circuits while allowing the solder bumps to be positioned closer together for finer pitch design
Solution Approach 2:
The patent adds a vertical dimension by introducing bump structures with height that protrude from the redistribution structure surface. This vertical separation creates additional spacing between solder bumps in the Z-direction, allowing horizontal pitch reduction without compromising reliability. The standoff height provides clearance that prevents bridging between adjacent bumps
2Manufacturing precision
If the pitch between solder bumps is reduced, then the fine pitch design is achieved, but the manufacturing precision and reliability are compromised
Solution Approach 1:
The patent segments the connection structure into multiple distinct components: the redistribution structure, the bump structures with insulating layers, and the solder bumps. This segmentation allows each component to be optimized independently - the insulating layers can be designed with sufficient thickness for isolation while the solder bumps can be positioned at finer pitches
Solution Approach 2:
The insulating layers within the bump structures serve as intermediary elements that maintain electrical isolation between adjacent solder bumps even when the horizontal distance between them is reduced. This intermediary layer enables fine pitch manufacturing without sacrificing the reliability needed to prevent short circuits
Data Source
AI summary
A semiconductor package includes a first redistribution structure, a semiconductor chip on the first redistribution structure, and a second redistribution structure on the semiconductor chip. The first redistribution structure has a first surface and an opposite second surface, and includes an insulating layer, and first redistribution conductors surrounded by the insulating layer. Bump structures are on the first surface, and include a first portion surrounded by the insulating layer and a second portion protruding from the first portion. Solder bumps are on the second portion of the bump structures. The second redistribution structure includes second redistribution conductors. The first redistribution conductors include first redistribution patterns and first redistribution vias electrically connecting the first redistribution patterns and the bump structures. The first redistribution vias have a side surface tapered toward the first surface, and the second portion of the bump structures has a side surface tapered away from the first surface.