Redistribution Package Structure for Compact Low-Loss Electronics
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Solution Overview
Problem
The challenge lies in miniaturizing electronic devices with multiple package components on a circuit board while reducing signal transmission loss and addressing manufacturing difficulties due to component displacement during assembly.
Innovation Solution
An electronic device comprising a base layer with via structures, a redistribution structure, electronic units, and a protecting layer, where the units are electrically connected through the redistribution structure and via structures, allowing for miniaturization and improved signal transmission by packaging the units together with a connecting component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple package components are disposed on a circuit board to integrate various functions, then device functionality is improved, but the size of the entire structure increases
Solution Approach 1:
The patent implements nesting by placing multiple package components (first package component and second package component) within a single package body. The first package component is disposed on the circuit board, and the second package component is disposed on top of or adjacent to the first package component, both enclosed within the same package body with sealing structure. This nested arrangement allows multiple functional components to be integrated in a compact space, reducing the overall footprint while maintaining diverse functionality.
2Loss of energy
If multiple package components are disposed on a circuit board to reduce distances between them, then signal transmission loss is reduced, but the entire structure cannot be further thinned or miniaturized due to process limitations
Solution Approach 1:
The patent transitions from a two-dimensional arrangement of components on the circuit board surface to a three-dimensional structure by stacking package components vertically within a package body. The first package component is positioned on the circuit board, and the second package component is positioned in the vertical dimension above or beside it, enclosed by the package body. This vertical stacking reduces horizontal distances between components, minimizing signal transmission loss while achieving miniaturization without excessive process complexity.
3Adaptability or versatility
If multiple package components are designed to be electrically connected to each other, then device functionality is improved, but manufacturing difficulty increases due to component displacement during assembly
Solution Approach 1:
The patent applies preliminary action by pre-disposing the first package component on the circuit board and pre-configuring its electrical connection structures (such as connection pads or terminals) before assembling the second package component. The package body is also prepared with corresponding sealing structures and opening positions in advance. This preliminary arrangement of components and connection structures simplifies the assembly process, reduces manufacturing difficulty, and ensures proper electrical connections while maintaining improved device functionality.
Data Source
AI summary
The present disclosure provides an electronic device and a manufacturing method. The electronic device includes a base layer, a first redistribution structure, a first electronic unit, a second electronic unit, a protecting layer, and a connecting component. The base layer includes at least one via structure. The first redistribution structure is disposed on the base layer, and the first electronic unit and the second electronic unit are disposed on the first redistribution structure. The protecting layer surrounds the first electronic unit and the second electronic unit, and the first electronic unit and the second electronic unit are electrically connected to the connecting component through the first redistribution structure and the at least one via structure.