Redistribution Package-on-Package for Ultra-Fine Pitch 3D Stacking
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Solution Overview
Problem
The semiconductor industry faces challenges in reducing the size and increasing the integration density of electronic components, requiring smaller packages that efficiently integrate multiple dies while minimizing area usage, especially in consumer mobile products.
Innovation Solution
A Redistribution Package-on-Package (PoP) structure is developed, involving a package substrate with front-side and back-side redistribution structures, vias, and encapsulation processes to form a 3D package design that reduces interconnect lengths and eliminates the need for additional substrates, using thin film processes to create a redistribution structure and attach multiple dies with reduced pitch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional packaging methods are used with additional substrates, then assembly flexibility is maintained, but package size and complexity increase
Solution Approach 1:
The patent merges the substrate function into the package structure itself by forming redistribution structures directly on the package substrate. This eliminates the need for separate additional substrates, thereby reducing package size while maintaining assembly flexibility. The redistribution structures are integrated into the package substrate, combining multiple functions into a single component.
Solution Approach 2:
The patent transitions from a planar 2D package layout to a 3D vertical stacking architecture. Multiple device dies are stacked vertically with redistribution structures connecting different layers through vias. This dimensional change allows higher integration density in a smaller footprint, reducing overall package volume while maintaining connectivity.
2Quantity of substance
If minimum feature size is reduced to increase integration density, then more components fit in given area, but manufacturing precision requirements increase
Solution Approach 1:
The package substrate is divided into multiple functional regions with redistribution structures formed in specific patterns. The segmentation allows optimization of each region for its specific function, enabling higher integration density while maintaining manufacturability through standardized processing steps for each segmented area.
Solution Approach 2:
The patent employs thin film processes to form redistribution structures with controlled thickness and dimensions. By precisely controlling film deposition parameters, the patent achieves the required manufacturing precision for reduced minimum feature sizes while maintaining high integration density across the package substrate.
3Length of stationary object
If 3D package design is implemented, then interconnect lengths are reduced, but warpage and heat dissipation challenges increase
Solution Approach 1:
The patent introduces a package substrate with integrated redistribution structures as an intermediary between device dies. This intermediary provides both electrical connectivity and mechanical support, managing the thermal and structural challenges of 3D stacking while maintaining short interconnect lengths through the vertical architecture.
Solution Approach 2:
The package substrate employs composite material structures with multiple layers including dielectric materials and conductive redistribution structures. This composite construction provides thermal management capabilities while maintaining mechanical stability and enabling effective heat dissipation in the 3D package design.
Data Source
AI summary
Embodiments relate to packages and methods of forming packages. A package includes a package substrate, a first device die, first electrical connectors, an encapsulant, a redistribution structure, and a second device die. The first device die is attached to a side of the package substrate, and the first electrical connectors are mechanically and electrically coupled to the side of the package substrate. The encapsulant at least laterally encapsulates the first electrical connectors and the first device die. The redistribution structure is on the encapsulant and the first electrical connectors. The redistribution structure is directly coupled to the first electrical connectors. The first device die is disposed between the redistribution structure and the package substrate. The second device die is attached to the redistribution structure by second electrical connectors, and the second electrical connectors are directly coupled to the redistribution structure.