Redistribution Package Reinforcement for Stress and Routing Area
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Solution Overview
Problem
Current wafer level packaging technologies face challenges in efficiently integrating semiconductor dies and antenna elements, leading to limitations in package structure design and reliability, particularly in terms of stress distribution and routing area utilization.
Innovation Solution
The method involves forming a package structure with a redistribution circuit structure on both sides of a semiconductor die, including through vias and metallization layers, and embedding reinforcement structures within these layers to enhance mechanical and electrical connectivity, while also integrating antenna elements for improved electromagnetic wave coverage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wafer level packaging technologies are used to integrate semiconductor dies and antenna elements, then integration is achieved, but stress distribution and routing area utilization are limited
Solution Approach 1:
The patent divides the package structure into multiple functional layers including redistribution circuit layers, antenna elements, and reinforcement structures. The reinforcement structures are segmented and positioned at specific locations to provide localized stress support where needed, rather than using a uniform structure throughout the package.
Solution Approach 2:
The patent introduces reinforcement structures that extend in diagonal directions across the package, adding structural support in dimensions not previously considered. This multi-directional reinforcement approach addresses stress distribution from multiple angles simultaneously.
2Ease of manufacture
If conventional packaging structures are used, then manufacturing is simpler, but routing area is insufficient
Solution Approach 1:
The redistribution circuit layers serve multiple functions: electrical interconnection between dies, stress distribution across the package, and providing routing pathways for signals. This multi-functionality increases effective routing area without adding separate dedicated routing structures.
Solution Approach 2:
The patent utilizes diagonal routing paths and multi-layer circuit arrangements to increase the effective routing area. By using three-dimensional space across multiple layers and diagonal trajectories, more routing capacity is achieved within the same planar footprint.
3Reliability
If reinforcement structures are added to redistribution circuit structure, then stress suppression is improved, but device complexity increases
Solution Approach 1:
Reinforcement structures are strategically positioned at specific high-stress locations within the package rather than being uniformly distributed. This localized approach provides stress suppression where most needed while minimizing the overall addition of structural elements.
Solution Approach 2:
The package structure combines multiple materials with different mechanical properties including dielectric materials, conductive traces, and reinforcement structures. This composite approach allows each material to be optimized for its specific function while working together to manage stress throughout the package.
Data Source
AI summary
A package structure includes an insulating encapsulation, at least one semiconductor die, a redistribution circuit structure, and first reinforcement structures. The at least one semiconductor die is encapsulated in the insulating encapsulation. The redistribution circuit structure is located on the insulating encapsulation and electrically connected to the at least one semiconductor die. The first reinforcement structures are embedded in the redistribution circuit structure. A shape of the package structure includes a polygonal shape on a vertical projection along a stacking direction of the insulating encapsulation and the redistribution circuit structure, and the first reinforcement structures are located on and extended along diagonal lines of the package structure.