Redistribution Package Structure for Shorter Signal Paths
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Solution Overview
Problem
Current electronic products face challenges in achieving smaller size, higher functionality, and higher density due to long communication paths, significant signal loss, and large occupied areas of active/passive components, making it difficult to integrate more circuits and reduce device thickness.
Innovation Solution
A package structure incorporating a connection member with a conductive connector and insulation layer, and a redistribution structure with dielectric layers and wiring patterns, integrating active and passive devices to reduce communication paths and occupied area, using dummy patterns and compensation structures to enhance planarization and improve device performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If component-embedded or chip-embedded types are used to integrate the chip and the active and passive components on the circuit substrate, then integration efficiency and functionality are improved, but the communication paths become longer and signal loss increases
Solution Approach 1:
The patent transitions from planar integration to three-dimensional vertical stacking, where active and passive components are arranged in multiple layers above the substrate. This vertical dimensionality change shortens horizontal communication paths while maintaining integration efficiency, directly addressing the signal loss problem caused by long communication paths in conventional embedded architectures.
Solution Approach 2:
The patent implements a nested structure where passive components are embedded within or around active components, and multiple functional layers are stacked within a compact vertical space. This nesting approach enables high integration efficiency while minimizing the distance between connected components, thereby reducing signal loss.
2Adaptability or versatility
If more active and passive components are integrated to increase functionality and density, then the occupied area of each component increases, making it difficult to reduce device size
Solution Approach 1:
The patent utilizes vertical stacking to arrange multiple functional layers in the third dimension, enabling high-density integration of active and passive components without increasing the planar footprint. This approach allows enhanced functionality while maintaining a compact device size, directly resolving the contradiction between component density and occupied area.
Solution Approach 2:
The patent combines multiple functions into integrated three-dimensional structures where active and passive components are closely coupled and share common support structures and interconnects. This merging reduces the total occupied area while maintaining full functionality, as components work together in a compact integrated manner rather than as separate discrete elements.
3Volume of moving object
If the thickness of active and passive devices is reduced to decrease device size, then integration density is improved, but manufacturing precision and device performance may be compromised
Solution Approach 1:
The patent divides the device into multiple thin functional layers stacked vertically, with each layer having a controlled thickness optimized for its specific function. This segmentation allows precise control of individual layer thicknesses during manufacturing while achieving overall compact device size, resolving the contradiction between reduced thickness and manufacturing precision.
Solution Approach 2:
The patent optimizes the thickness parameters of individual layers and the spacing between layers to achieve the desired device performance and size. By carefully controlling these dimensional parameters through advanced manufacturing processes, the patent enables thin device construction without compromising manufacturing precision or device functionality.
Data Source
AI summary
The present disclosure provides a package structure, an antenna module, and a probe card. The package structure includes a connection member and a first redistribution structure disposed on the connection member. The connection member includes a conductive connector and an insulation layer surrounding the conductive connector. The first redistribution structure includes a first dielectric layer, and a first wiring pattern, and a first device. The first dielectric layer is disposed on the connection member. The first wiring pattern is disposed in the first dielectric layer. The first device is disposed above the first dielectric layer and is electrically connected to the conductive connector.