Redistribution Substrate Package With Undercut Conductive Structure
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving improved electrical and thermal properties, as well as efficiency and simplification in fabrication processes.
Innovation Solution
A semiconductor package design incorporating a first redistribution substrate with conductive structures featuring undercuts and protrusions, along with a molding layer and a second redistribution substrate, enhances electrical connectivity and thermal management while allowing for efficient fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor package structures are used, then fabrication processes are simplified, but electrical and thermal performance are insufficient
Solution Approach 1:
The conductive structure is divided into multiple segments including a first conductive structure with an undercut portion and a second conductive structure with a protrusion portion. This segmentation allows each part to perform specific functions: the undercut enables molding material flow and anchoring, while the protrusion provides mechanical interlocking and electrical connectivity, thereby improving overall electrical and thermal performance without requiring a completely new structure.
Solution Approach 2:
The second conductive structure is nested on top of the first conductive structure, forming a multi-layered configuration. The protrusion of the second conductive structure fits into the undercut of the first conductive structure, creating a nested arrangement that enhances electrical connectivity and thermal conduction while maintaining a compact package footprint.
2Reliability
If complex conductive structures with undercuts and protrusions are implemented, then electrical connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
The undercut portion is formed in the first conductive structure before the second conductive structure is deposited. This preliminary action creates a prepared interface that guides the subsequent formation of the protrusion, ensuring proper alignment and fit without requiring complex real-time adjustments during manufacturing. The sequence of operations simplifies the overall fabrication process by pre-establishing the geometric relationships needed for electrical connectivity.
3Temperature
If traditional molding processes are used, then fabrication is simplified, but thermal management capabilities are insufficient
Solution Approach 1:
The molding structure is designed with varying local properties: the molding material fills the undercut portion of the first conductive structure and surrounds the protrusion of the second conductive structure, creating regions with different thermal conductivities. The areas in contact with conductive structures have enhanced thermal management properties, while other regions maintain mechanical support functions, achieving effective thermal management without requiring complete structural redesign.
Data Source
AI summary
A semiconductor device includes a first redistribution substrate, a semiconductor chip on a top surface of the first redistribution substrate, a conductive structure on the top surface of the first redistribution substrate and laterally spaced apart from the semiconductor chip, and a molding layer on the first redistribution substrate and covering a sidewall of the semiconductor chip and a sidewall of the conductive structure. The conductive structure includes a first conductive structure having a first sidewall, and a second conductive structure on a top surface of the first conductive structure and having a second sidewall. The first conductive structure has an undercut at a lower portion of the first sidewall. The second conductive structure has a protrusion at a lower portion of the second sidewall.