Redistribution Pad Layout for Reliable Semiconductor Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As semiconductor packages become smaller, lighter, and more high-performance, they face challenges in maintaining high reliability while managing increased power consumption and the need for stable power supply.
Innovation Solution
The semiconductor package incorporates a first and second redistribution substrate with multi-layered redistribution lines, a through post, and specific pad designs, including a flat first-type pad and a second-type pad with an outer protruding portion, to enhance reliability and power management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor packages are reduced in size and weight to meet user demands, then portability and compactness are improved, but power consumption increases and reliability becomes more difficult to maintain
Solution Approach 1:
The package is divided into multiple redistribution substrates (first and second redistribution substrates) with separate pad regions, allowing independent optimization of power supply and signal transmission paths. This segmentation enables better thermal management and electrical isolation, maintaining reliability in compact packages
Solution Approach 2:
The invention transitions from planar pad arrangement to three-dimensional multi-layer redistribution substrate structure. Multiple pad regions are arranged at different heights and locations, enabling efficient power distribution and signal routing in limited space while maintaining electrical performance and reliability
2Productivity
If high-performance and high-capacity semiconductor packages are developed, then processing power and functionality are improved, but power consumption increases
Solution Approach 1:
Different pad regions are designed with distinct characteristics: first pad region optimized for power supply with specific geometry, second pad region for signal transmission. This local optimization allows efficient power distribution to high-performance components while minimizing overall power consumption through targeted electrical pathways
3Reliability
If stable power supply is required for high-performance packages, then power distribution network complexity increases, but power supply stability is improved
Solution Approach 1:
The redistribution substrates serve multiple functions simultaneously: power distribution, signal transmission, and mechanical support. The pad regions are designed to handle both power and signal functions, reducing the need for separate dedicated power distribution networks and simplifying overall package complexity while maintaining stable power supply
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the reliability of the semiconductor package by preventing defects such as discoloration, peeling, and cracks, while also optimizing power supply stability and efficiency.
Implementation Method 1
forming an uppermost redistribution line having a lower metal layer of copper (Cu) and an upper metal layer of nickel (Ni) through electroplating
Data Source
AI summary
Provided are a semiconductor package including a pad with high reliability and a method of manufacturing the semiconductor package. The semiconductor package includes a first redistribution substrate, a semiconductor chip on the first redistribution substrate, a through post extending around the semiconductor chip and on the first redistribution substrate, and a second redistribution substrate on the semiconductor chip and the through post. A first pad region and a second pad region are defined on an upper surface of the second redistribution substrate, the first pad region positioned at a central portion of the second redistribution substrate, and the second pad region extending around the first pad region, a first-type pad in a planar shape is in a first opening, a second-type pad having an outer protruding portion is in a second opening.