Redistribution Pad Layout Using Different Levels to Prevent Shorts
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Solution Overview
Problem
As semiconductor devices shrink in size, the number of bonding pads increases, leading to reduced gaps between pads, which poses challenges in electrical connection and potential for electrical shorts.
Innovation Solution
The semiconductor device incorporates re-distribution pads at different levels, with a first re-distribution pad on a lower dielectric layer and a second re-distribution pad on an upper dielectric layer, allowing for sufficient spacing of chip wire bases and preventing electrical shorts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the size of semiconductor devices is decreased, then the integration density is improved, but the gaps between bonding pads are reduced leading to increased risk of electrical shorts
Solution Approach 1:
The patent introduces a vertical dimension by forming re-distribution pads at different heights using multiple dielectric layers. The first re-distribution pad is formed on the lower dielectric layer while the second re-distribution pad is formed on the upper dielectric layer, creating a three-dimensional pad structure that increases spacing between electrical connections without increasing the horizontal footprint of the device.
Data Source
AI summary
A semiconductor device includes a chip body; a passivation layer on the chip body; a lower dielectric layer on the passivation layer; a first re-distribution pad on the lower dielectric layer; an upper dielectric layer on the lower dielectric layer, the upper dielectric layer having a groove that exposes an upper surface of the first re-distribution pad; and a second re-distribution pad on the upper dielectric layer. An upper surface of the second re-distribution pad is positioned at a higher level than the upper surface of the first re-distribution pad.