Redistribution Pad Layout for Dense Semiconductor Package Testing
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Solution Overview
Problem
The reliability and efficiency of measuring electrical connection paths in semiconductor packages are compromised due to the increasing integration of semiconductor chips, which requires more precise and reliable connection structures.
Innovation Solution
A semiconductor package design featuring alternately stacked redistribution layers and insulating layers with pads having an aspect ratio greater than 2, including offset pad portions and a connection portion with a protruding portion to enhance reliability measurement and electrical connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the degree of integration of semiconductor chips is increased, then the line widths of redistribution lines and intervals between bumps are narrowed, but the reliability of the electrical connection path deteriorates
Solution Approach 1:
each pad includes a first pad portion offset in a first direction from a center of the pad and arranged to face one of the plurality of bumps; a second pad portion offset from the center of the pad in a second direction different from the first direction; and a connection portion connecting the first and second pad portions
2Area of stationary object
If the line widths of redistribution lines and intervals between bumps are narrowed, then the density of the package is increased, but the efficiency of measuring the reliability deteriorates
Solution Approach 1:
The first pad portion is arranged to face one of the plurality of bumps for electrical connection, while the second pad portion is positioned to serve as a measurement point, allowing the pad to simultaneously perform connection and measurement functions
3Reliability
If pads with aspect ratio greater than 2 are used, then the electrical connection reliability is improved, but the device complexity increases
Solution Approach 1:
a surface of each of the pads that faces the plurality of bumps has an aspect ratio greater than 2
Data Source
AI summary
A semiconductor package includes a redistribution structure in which redistribution layers and insulating layers are alternately stacked. A semiconductor chip is electrically connected to the redistribution layers, and bumps are electrically connected to the redistribution layers and arranged on one surface of the redistribution structure. The redistribution layers include pads arranged to face the bumps, and each of the pads includes a first pad portion offset from a center of each of the pads in a first direction, a second pad portion offset from the center of each of the pads in a second direction, and a connection portion connecting the first and second pad portions. The connection portion includes a protruding portion that defines a first recessed region recessed adjacent to the first pad portion and a second recessed region recessed adjacent to the second pad portion.