Semiconductor Package Redistribution Pad Warpage Compensation
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Solution Overview
Problem
Semiconductor packages with redistribution layers face challenges in maintaining connection reliability due to warpage issues caused by differing thermal expansion coefficients of materials, leading to potential connection failures with electronic devices.
Innovation Solution
The semiconductor package incorporates redistribution pads of varying widths and heights, with the second redistribution pad being wider and taller than the first, to improve coplanarity and reliability of solder balls, addressing warpage and connection issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If redistribution pads of uniform width are used, then manufacturing process is simple, but connection reliability deteriorates due to warpage
Solution Approach 1:
The patent applies local quality by making the second redistribution pad have a greater width than the first redistribution pad. This non-uniform width distribution compensates for warpage effects in different regions of the semiconductor package, with wider pads positioned to counteract greater deflection in those areas, thereby maintaining connection reliability despite the increased structural complexity.
2Reliability
If all solder balls have the same height, then manufacturing is easier, but coplanarity deteriorates due to warpage
Solution Approach 1:
The patent implements local quality by configuring the second solder ball to have a greater height than the first solder ball. This differential height compensation addresses warpage-induced non-coplanarity by raising solder balls in regions that experience greater downward deflection, ensuring all solder ball tops remain coplanar despite the increased precision requirements.
3Reliability
If redistribution structure is made thicker to compensate for warpage, then connection reliability improves, but package thickness increases
Solution Approach 1:
The patent applies parameter changes by modifying the width and height parameters of specific redistribution pads and solder balls rather than uniformly increasing the entire package thickness. The second redistribution pad is made wider and the second solder ball is made taller to provide localized warpage compensation, maintaining connection reliability without increasing the overall package thickness.
Data Source
AI summary
A semiconductor package having a redistribution structure including a first face and a second face and a first semiconductor chip mounted on the first face. The semiconductor package may further include a first redistribution pad exposed from the second face of the redistribution structure and a second redistribution pad exposed from the second face of the redistribution structure. The semiconductor package may further include a first solder ball being in contact with the first redistribution pad and a second solder ball being in contact with the second redistribution pad. In some embodiments, a first distance of the first redistribution pad is smaller than a second distance of the second redistribution pad, the first and second distances are measured with respect to a reference plane that intersects a lower portion of the first solder ball and a lower portion of the second solder ball.