Redistribution Pattern Layout for Reliable IC Power Connections

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Solution Overview

Problem

Integrated circuit devices face challenges in maintaining reliability and secure electrical connections due to the miniaturization and increased functionality of electronic devices, which existing redistribution patterns struggle to address effectively.

Innovation Solution

The integrated circuit device incorporates a multilayer wiring structure with redistribution patterns, including pad, dummy, and power patterns, where dummy patterns extend in lines parallel to the substrate and are fully surrounded by insulating layers to ensure electrical isolation, and power patterns are connected to multiple via plugs for enhanced reliability and power transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If redistribution patterns are used to supply power and secure electrical connections in highly integrated circuit devices, then the reliability of electrical connections is improved, but the complexity of the wiring structure increases

Engineering Contradiction:

Improvereliability of electrical connectionsVSAvoidcomplexity of wiring structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The redistribution patterns are divided into multiple types including pad patterns for electrical connections, dummy patterns for structural support, and power patterns for power supply. This segmentation allows each pattern type to fulfill its specific function independently, improving overall connection reliability while organizing the complexity into manageable functional units

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The multilayer wiring structure integrates multiple functions into a unified system: signal transmission, power distribution, and mechanical support are all achieved through the coordinated arrangement of different pattern types across multiple layers, reducing the need for separate dedicated structures for each function

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Manufacturing precision

If the thickness of redistribution patterns is increased to minimize distortion due to grain boundaries, then the manufacturing precision is improved, but the device complexity increases

Engineering Contradiction:

Improveminimization of grain boundary distortionVSAvoidcomplexity of redistribution pattern structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The thickness of redistribution patterns is optimized to specific ranges (e.g., 100 nm to 500 nm) to minimize grain boundary distortion effects. By controlling the thickness parameter within this optimal range, the manufacturing precision is improved while avoiding excessive thickness that would unnecessarily increase device complexity

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

Instead of increasing pattern thickness excessively, the design distributes functional elements across multiple layers vertically. This dimensional approach achieves the needed structural robustness and electrical performance through layering rather than through excessive thickness in a single layer

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If dummy patterns are completely surrounded by insulating layers to ensure electrical isolation, then the reliability is improved, but the manufacturing process complexity increases

Engineering Contradiction:

Improveelectrical isolation of dummy patternsVSAvoidcomplexity of insulating layer structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Dummy patterns are completely extracted from the electrical conduction network by surrounding them with insulating layers on all surfaces. This isolation extracts them from the electrical system, ensuring they cannot cause short circuits or interference, while their structural support function is maintained

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Insulating layers serve as intermediary elements between dummy patterns and other conductive elements. These intermediary layers provide the necessary electrical isolation, allowing dummy patterns to coexist with functional wiring structures without direct electrical contact

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS12154881B2Integrated circuit device having redistribution pattern

Publication Date: 2024.11.26 SAMSUNG ELECTRONICS CO LTD

AI summary

An integrated circuit device includes a wiring structure, first and second inter-wiring insulating layers, redistributions patterns and a cover insulating layer. The wiring structure includes wiring layers having a multilayer wiring structure and via plugs. The first inter-wiring insulating layer that surrounds the wiring structure on a substrate. The second inter-wiring insulating layer is on the first inter-wiring insulating layer, and redistribution via plugs are connected to the wiring structure through the second inter-wiring insulating layer. The redistribution patterns includes pad patterns and dummy patterns on the second inter-wiring insulating layer. Each patterns has a thickness greater than a thickness of each wiring layer. The cover insulating layer covers some of the redistribution patterns. The dummy patterns are in the form of lines that extend in a horizontal direction parallel to the substrate.